Koupit GAA3R513 s BYCHPS
Koupit se zárukou
GAA3R513
- Part Number:
- GAA3R513
- Výrobce:
- Sprague Goodman
- Popis:
- CAP TRIMMER 0.35-3.5PF 250V TH
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19869 Pieces
- Datový list:
- GAA3R513.pdf
Úvod
BYCHIPS je distribuční odrůda pro GAA3R513, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu GAA3R513 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 250V |
|---|---|
| Velikost / Rozměry: | Round - 0.161" Dia (4.10mm) |
| Série: | - |
| Obal: | Bulk |
| Ostatní jména: | SG4008 |
| Typ montáže: | Through Hole |
| Výrobní číslo výrobce: | GAA3R513 |
| Výška - Sedící (Max): | - |
| Funkce: | General Purpose |
| Rozšířený popis: | 0.35 ~ 3.5pF Trimmer Capacitor 250V Side Adjustment Through Hole |
| Popis: | CAP TRIMMER 0.35-3.5PF 250V TH |
| Rozsah kapacitního: | 0.35 ~ 3.5pF |
| Typ úpravy: | Side Adjustment |
| Email: | [email protected] |
Související díly pro GAA3R513
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
GAA3R512 | Sprague-Goodman | CAP TRIMMER 0.35-3.5PF 250V TH | Dotaz |
|
GAA3R503 | Sprague-Goodman | CAP TRIM 0.35-3.5PF 250V PNL MNT | Dotaz |
|
GAA3R501 | Sprague-Goodman | CAP TRIMMER 0.35-3.5PF 250V PNL | Dotaz |
|
GAA3R514 | Sprague-Goodman | CAP TRIM 0.35-3.5PF 250V SMD | Dotaz |
|
GGV18031 | Sprague-Goodman | CAP TRIM 0.8-18PF 1.25KV SMD | Dotaz |
 |
GKY40056 | Sprague-Goodman | CAP TRIMMER 8-40PF 50V SMD | Dotaz |
|
GAA3R505 | Sprague-Goodman | CAP TRIM 0.35-3.5PF 250V SMD | Dotaz |
 |
SGNMNC3708EK | Sprague-Goodman | CAP TRIM 6.5-70PF 6KV CHASS MNT | Dotaz |
|
GNC8R050 | Sprague-Goodman | CAP TRIM 0.8-8PF 500V THRU HOLE | Dotaz |
|
GGN12031 | Sprague-Goodman | CAP TRIM 0.8-12PF 750V SURF MNT | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers