Koupit SD1274 s BYCHPS
Koupit se zárukou
SD1274
- Part Number:
- SD1274
- Výrobce:
- ST
- Popis:
- TRANS NPN RF MICROWAVE VHF M135
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15507 Pieces
- Datový list:
- SD1274.pdf
Úvod
BYCHIPS je distribuční odrůda pro SD1274, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu SD1274 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 16V |
|---|---|
| Transistor Type: | NPN |
| Dodavatel zařízení Package: | M135 |
| Série: | - |
| Power - Max: | 70W |
| Obal: | Bulk |
| Paket / krabice: | M135 |
| Ostatní jména: | 497-5453 SD1274-ND |
| Provozní teplota: | 200°C (TJ) |
| Hluk Obrázek (dB Typ @ f): | - |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | SD1274 |
| Získat: | 10dB |
| Frekvence - Přechod: | - |
| Rozšířený popis: | RF Transistor NPN 16V 8A 70W Surface Mount M135 |
| Popis: | TRANS NPN RF MICROWAVE VHF M135 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 250mA, 5V |
| Proud - Collector (Ic) (Max): | 8A |
| Email: | [email protected] |
Související díly pro SD1274
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
SD1275-01 | STMicroelectronics | TRANS NPN RF MICROWAVE VHF M113 | Dotaz |
 |
SD1275 | STMicroelectronics | TRANS NPN RF MICROWAVE VHF M135 | Dotaz |
 |
10502 | Microsemi Corporation | TRANS BIPO 50V 500W 55SM | Dotaz |
 |
BFU725F,115 | NXP USA Inc. | TRANS NPN 20GHZ SOT343F | Dotaz |
|
SD1274-01 | STMicroelectronics | TRANS NPN RF MICROWAVE VHF M113 | Dotaz |
 |
2SC5007-A | CEL | RF TRANSISTOR NPN SOT-523 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers