Koupit 10502 s BYCHPS
Koupit se zárukou
Úvod
BYCHIPS je distribuční odrůda pro 10502, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 10502 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 65V |
|---|---|
| Transistor Type: | NPN |
| Dodavatel zařízení Package: | 55SM |
| Série: | - |
| Power - Max: | 1458W |
| Obal: | Bulk |
| Paket / krabice: | 55SM |
| Ostatní jména: | 10502MS |
| Provozní teplota: | 230°C (TJ) |
| Hluk Obrázek (dB Typ @ f): | - |
| Typ montáže: | Chassis Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | 10502 |
| Získat: | 8.5dB |
| Frekvence - Přechod: | - |
| Rozšířený popis: | RF Transistor NPN 65V 40A 1458W Chassis Mount 55SM |
| Popis: | TRANS BIPO 50V 500W 55SM |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 5A, 5V |
| Proud - Collector (Ic) (Max): | 40A |
| Email: | [email protected] |
Související díly pro 10502
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
BFR 740L3RH E6327 | Infineon Technologies | TRANS RF BIPO NPN 30MA TSLP-3 | Dotaz |
 |
MRF8372 | Microsemi Corporation | TRANS NPN 16V 200MA SO8 | Dotaz |
|
MS2200 | Microsemi Corporation | TRANS RF BIPO 1167W 43.2A MS102 | Dotaz |
 |
FMMT5179TC | Diodes Incorporated | TRANSISTOR RF NPN SOT23-3 | Dotaz |
|
23A025 | Microsemi Corporation | TRANS RF BIPO 9W 1.2A 55BT2 | Dotaz |
 |
NE68130-T1-R34-A | CEL | SAME AS 2SC4227 NPN SILICON AMPL | Dotaz |
 |
BFR94AW,115 | NXP USA Inc. | TRANS NPN 5GHZ SOT323 | Dotaz |
 |
BFG540/X,215 | NXP USA Inc. | TRANS NPN 15V 9GHZ SOT143B | Dotaz |
|
BFU530XRR | NXP USA Inc. | TRANS RF NPN 12V 40MA SOT-143R | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers