Koupit GKU30001 s BYCHPS
Koupit se zárukou
GKU30001
- Part Number:
- GKU30001
- Výrobce:
- Sprague Goodman
- Popis:
- CAP TRIMMER 5-30PF 250V TH
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18668 Pieces
- Datový list:
- GKU30001.pdf
Úvod
BYCHIPS je distribuční odrůda pro GKU30001, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu GKU30001 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 250V |
|---|---|
| Velikost / Rozměry: | Round - 0.197" Dia (5.00mm) |
| Série: | GKU-01 |
| Obal: | Bulk |
| Ostatní jména: | Q6544943 |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | GKU30001 |
| Výška - Sedící (Max): | 0.236" (6.00mm) |
| Funkce: | General Purpose |
| Rozšířený popis: | 5 ~ 30pF Trimmer Capacitor 250V Top Adjustment Through Hole |
| Popis: | CAP TRIMMER 5-30PF 250V TH |
| Rozsah kapacitního: | 5 ~ 30pF |
| Typ úpravy: | Top Adjustment |
| Email: | [email protected] |
Související díly pro GKU30001
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
GKU30020 | Sprague-Goodman | CAP TRIM 7-30PF 200V THRU HOLE | Dotaz |
|
GZC23112 | Sprague-Goodman | CAP TRIM 15-230PF 100V THRU HOLE | Dotaz |
|
GAA6R004 | Sprague-Goodman | CAP TRIMMER 0.6-6PF 250V TH | Dotaz |
 |
BFC280907011 | Vishay BC Components | CAP TRIM 5-60PF 200V THRU HOLE | Dotaz |
|
BFC280801029 | Vishay BC Components | CAP TRIM 5.5-50PF 150V THRU HOLE | Dotaz |
 |
CTZ3E-40C-W1-PF | AVX Corporation | CAP TRIMMER 4.5-40PF 25V SMD | Dotaz |
|
GZA40002 | Sprague-Goodman | CAP TRIM 4-40PF 100V THRU HOLE | Dotaz |
 |
GKY30056 | Sprague-Goodman | CAP TRIMMER 5.5-30PF 50V SMD | Dotaz |
 |
CTZ3S-40C-W1-F | AVX Corporation | CAP TRIMMER 4.5-40PF 25V SMD | Dotaz |
|
GQW9R500 | Sprague-Goodman | CAP TRIM 0.6-9.5PF 750V PNL MNT | Dotaz |
|
GKU30010 | Sprague-Goodman | CAP TRIMMER 5.5-30PF 250V TH | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers