Koupit GDT40026 s BYCHPS
Koupit se zárukou
GDT40026
- Part Number:
- GDT40026
- Výrobce:
- Sprague Goodman
- Popis:
- CAP TRIM 1.5-40PF 250V THRU HOLE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18788 Pieces
- Datový list:
- GDT40026.pdf
Úvod
BYCHIPS je distribuční odrůda pro GDT40026, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu GDT40026 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 250V |
|---|---|
| Velikost / Rozměry: | 0.311" Dia x 0.630" L (7.90mm x 16.00mm) |
| Série: | - |
| Obal: | Bulk |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | GDT40026 |
| Výška - Sedící (Max): | - |
| Funkce: | Sealed |
| Rozšířený popis: | 1.5 ~ 40pF Trimmer Capacitor 250V Top Adjustment Through Hole |
| Popis: | CAP TRIM 1.5-40PF 250V THRU HOLE |
| Rozsah kapacitního: | 1.5 ~ 40pF |
| Typ úpravy: | Top Adjustment |
| Email: | [email protected] |
Související díly pro GDT40026
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
GDT40031 | Sprague-Goodman | CAP TRIM 1.5-40PF 250V SURF MNT | Dotaz |
|
GYA5R002 | Sprague-Goodman | CAP TRIM 1.6-5PF 100V THRU HOLE | Dotaz |
|
GMA31000 | Sprague-Goodman | CAP TRIM 130-450PF 175V T/H | Dotaz |
|
GXF40003 | Sprague-Goodman | CAP TRIM 4-40PF 200V THRU HOLE | Dotaz |
|
GFN36033 | Sprague-Goodman | CAP TRIM 1-36PF 750V SURF MOUNT | Dotaz |
|
GKU70020 | Sprague-Goodman | CAP TRIM 13-70PF 100V THRU HOLE | Dotaz |
|
GHL38000 | Sprague-Goodman | CAP TRIMMER TH | Dotaz |
 |
JR060 | Knowles Voltronics | CAP TRIMMER 2-6PF 100V SMD | Dotaz |
|
GNV1R200 | Sprague-Goodman | CAP TRIM 0.3-1.2PF 500V SURF MNT | Dotaz |
|
GKG10021 | Sprague-Goodman | CAP TRIMMER 3.5-10PF 100V TH | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers