Koupit CENGSH7760-10-504HCR s BYCHPS
Koupit se zárukou
CENGSH7760-10-504HCR
- Part Number:
- CENGSH7760-10-504HCR
- Výrobce:
- Logic PD, Inc.
- Popis:
- CARD ENGINE 32MB FLASH 64MB RAM
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12274 Pieces
- Datový list:
- CENGSH7760-10-504HCR.pdf
Úvod
BYCHIPS je distribuční odrůda pro CENGSH7760-10-504HCR, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu CENGSH7760-10-504HCR e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Rychlost: | 198MHz |
|---|---|
| Velikost / Rozměry: | 2.37" x 2.67" (60.2mm x 67.8mm) |
| Série: | - |
| RAM Size: | 64MB |
| Provozní teplota: | 0°C ~ 70°C |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Modul / Type Board: | MPU Core |
| Výrobní číslo výrobce: | CENGSH7760-10-504HCR |
| Flash Velikost: | 32MB |
| Rozšířený popis: | - Embedded Module SH7760 198MHz 64MB 32MB |
| Popis: | CARD ENGINE 32MB FLASH 64MB RAM |
| core: | SH7760 |
| Typ konektoru: | SO-DIMM-144 |
| Co-Processor: | - |
| Email: | [email protected] |
Související díly pro CENGSH7760-10-504HCR
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
CENGSH7727-20-404HC | Logic | CARD ENGINE 32MB FLASH 32MB RAM | Dotaz |
 |
3358-IX-X38-RI | Critical Link LLC | MITYSOM-3358 W/ AM3358 | Dotaz |
|
CENGSH7760-10-504HC | Logic | CARD ENGINE 32MB FLASH 64MB RAM | Dotaz |
|
CENGSH7727-20-403HC | Logic | CARD ENGINE 16MB FLASH 32MB RAM | Dotaz |
|
CENGSH7760-10-503HC | Logic | CARD ENGINE 16MB FLASH 64MB RAM | Dotaz |
 |
BS2PX24 | Parallax Inc. | MODULE BASIC STAMP 2PX24 | Dotaz |
 |
CC-MX-LD6A-ZM-B | Digi International | MOD I.MX53 1GB FLASH 512MB 25PK | Dotaz |
 |
100-1254-2 | Bluetechnix GmbH | MODULE BF527-C-C-Q50S64F8 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers