Koupit 28R0453-30T s BYCHPS
Koupit se zárukou
28R0453-30T
- Part Number:
- 28R0453-30T
- Popis:
- FERRITE CORE SOLID
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14807 Pieces
Úvod
BYCHIPS je distribuční odrůda pro 28R0453-30T, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 28R0453-30T e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Flat |
|---|---|
| Série: | 28 |
| hodnocení: | - |
| Vnější rozměr: | - |
| Typ montáže: | - |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Materiál: | 28 |
| Výrobní standardní doba výroby: | 10 Weeks |
| Výrobní číslo výrobce: | 28R0453-30T |
| Délka: | - |
| Vnitřní rozměr: | - |
| Impedance @ Frekvence: | - |
| Rozšířený popis: | Solid Ferrite Core |
| Design: | Solid |
| Popis: | FERRITE CORE SOLID |
| Email: | [email protected] |
Související díly pro 28R0453-30T
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
28R0453-100 | Laird-Signal Integrity Products | FERRITE CORE SOLID | Dotaz |
 |
HFB187102-100 | Laird-Signal Integrity Products | FERRITE CORE 205 OHM SOLID | Dotaz |
|
28R0480-100 | Laird-Signal Integrity Products | FERRITE CORE 150 OHM SOLID | Dotaz |
 |
28R0453-300 | Laird-Signal Integrity Products | FERRITE CORE 160 OHM SOLID | Dotaz |
|
28R0492-100 | Laird-Signal Integrity Products | FERRITE CORE 150 OHM SOLID | Dotaz |
 |
28R0453-200 | Laird-Signal Integrity Products | FERRITE CORE 104 OHM SOLID | Dotaz |
 |
28R0480-000 | Laird-Signal Integrity Products | FERRITE CORE 190 OHM SOLID | Dotaz |
 |
28R2170-000 | Laird-Signal Integrity Products | FERRITE CORE 280 OHM SOLID | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers