Koupit 28R0453-300 s BYCHPS
Koupit se zárukou
28R0453-300
- Part Number:
- 28R0453-300
- Popis:
- FERRITE CORE 160 OHM SOLID
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17778 Pieces
Úvod
BYCHIPS je distribuční odrůda pro 28R0453-300, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 28R0453-300 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Flat |
|---|---|
| Série: | 28 |
| hodnocení: | - |
| Vnější rozměr: | 0.453" W x 0.118" H (11.50mm x 3.00mm) |
| Ostatní jména: | 240-2321 |
| Typ montáže: | Free Hanging |
| Materiál: | 28 |
| Výrobní standardní doba výroby: | 10 Weeks |
| Výrobní číslo výrobce: | 28R0453-300 |
| Délka: | 0.787" (20.00mm) |
| Vnitřní rozměr: | 0.315" W x 0.028" H (8.00mm x 0.70mm) |
| Impedance @ Frekvence: | 160 Ohm @ 100MHz |
| Rozšířený popis: | Solid Free Hanging Ferrite Core 160 Ohm @ 100MHz ID 0.315" W x 0.028" H (8.00mm x 0.70mm) OD 0.453" W x 0.118" H (11.50mm x 3.00mm) Length 0.787" (20.00mm) |
| Design: | Solid |
| Popis: | FERRITE CORE 160 OHM SOLID |
| Email: | [email protected] |
Související díly pro 28R0453-300
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
28R0453-200 | Laird-Signal Integrity Products | FERRITE CORE 104 OHM SOLID | Dotaz |
 |
28R0453-100 | Laird-Signal Integrity Products | FERRITE CORE SOLID | Dotaz |
|
28R0453-30T | Laird-Signal Integrity Products | FERRITE CORE SOLID | Dotaz |
|
28R0480-100 | Laird-Signal Integrity Products | FERRITE CORE 150 OHM SOLID | Dotaz |
 |
LFB095051-000 | Laird-Signal Integrity Products | FERRITE CORE 86 OHM SOLID 5.1MM | Dotaz |
|
28R0492-100 | Laird-Signal Integrity Products | FERRITE CORE 150 OHM SOLID | Dotaz |
 |
28R0480-000 | Laird-Signal Integrity Products | FERRITE CORE 190 OHM SOLID | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers