Koupit ZLFBLST0S2064GR5621 s BYCHPS
Koupit se zárukou
ZLFBLST0S2064GR5621
- Part Number:
- ZLFBLST0S2064GR5621
- Výrobce:
- Maxim Integrated
- Popis:
- IC 64K FLASH RC BLASTER 20-SOIC
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19477 Pieces
- Datový list:
- ZLFBLST0S2064GR5621.pdf
Úvod
BYCHIPS je distribuční odrůda pro ZLFBLST0S2064GR5621, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu ZLFBLST0S2064GR5621 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 1.9 V ~ 3.6 V |
|---|---|
| Dodavatel zařízení Package: | 20-SOIC |
| Série: | Crimzon™ |
| RAM Size: | - |
| Typ programu Paměť: | FLASH (64 kB) |
| Obal: | Tube |
| Paket / krabice: | 20-SOIC (0.295", 7.50mm Width) |
| Ostatní jména: | 269-4729 |
| Provozní teplota: | - |
| Počet I / O: | 4 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | ZLFBLST0S2064GR5621 |
| Rozhraní: | I²C, UART |
| Popis: | IC 64K FLASH RC BLASTER 20-SOIC |
| core: | Z8 (Crimzon) |
| Controller Series: | RC Blaster™ |
| Aplikace: | Multimedia, Universal Infrared Control |
| Email: | [email protected] |
Související díly pro ZLFBLST0S2064GR5621
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
ZLFBLST0P2064GR5621 | Maxim Integrated | IC 64K FLASH RC BLASTER 20DIP | Dotaz |
|
ZLFBLST0H2064GR5621 | Maxim Integrated | IC 64K FLASH RC BLASTER 20-SSOP | Dotaz |
 |
Z8930112PSG | Zilog | IC TV/VCR COMP VID O/P OTP 52DIP | Dotaz |
 |
AT97SC3205T-G3M44-20 | Microchip Technology | PROD STD COM I2C TPM 4X4 32VQFN | Dotaz |
|
ZLFBLST0Q2064GR5621 | Maxim Integrated | IC 64K FLASH RC BLASTER 20-QFN | Dotaz |
 |
TLE9833QXXUMA1 | Infineon Technologies | IC MOTOR DRIVER 48VQFN | Dotaz |
 |
CY7C64613-52NC | Cypress Semiconductor Corp | IC MCU USB EZ FX 8K RAM 52QFP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers