Koupit W9425G6JB-5I TR s BYCHPS
Koupit se zárukou
W9425G6JB-5I TR
- Part Number:
- W9425G6JB-5I TR
- Výrobce:
- Winbond Electronics Corporation
- Popis:
- IC SDRAM 256MBIT 200MHZ 60BGA
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18050 Pieces
- Datový list:
- W9425G6JB-5I TR.pdf
Úvod
BYCHIPS je distribuční odrůda pro W9425G6JB-5I TR, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu W9425G6JB-5I TR e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 2.3 V ~ 2.7 V |
|---|---|
| Dodavatel zařízení Package: | 60-TFBGA (13x8) |
| Rychlost: | 200MHz |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 60-TFBGA |
| Provozní teplota: | -40°C ~ 85°C (TA) |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Typ paměti: | Volatile |
| Velikost paměti: | 256Mb (16M x 16) |
| Formát paměti: | DRAM |
| Výrobní číslo výrobce: | W9425G6JB-5I TR |
| Rozhraní: | Parallel |
| Popis: | IC SDRAM 256MBIT 200MHZ 60BGA |
| Email: | [email protected] |
Související díly pro W9425G6JB-5I TR
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
W9425G6EH-5 | Winbond Electronics | IC SDRAM 256MBIT 250MHZ 66TSOP | Dotaz |
|
W9425G6KH-5I TR | Winbond Electronics | IC SDRAM 256MBIT 200MHZ 66TSOP | Dotaz |
|
W9425G6KH-5 | Winbond Electronics | IC SDRAM 256MBIT 200MHZ 66TSOP | Dotaz |
 |
W9425G6JB-5I | Winbond Electronics | IC SDRAM 256MBIT 200MHZ 60BGA | Dotaz |
|
W9425G6KH-5I | Winbond Electronics | IC SDRAM 256MBIT 200MHZ 66TSOP | Dotaz |
|
W9425G6JB-5 TR | Winbond Electronics | IC SDRAM 256MBIT 200MHZ 60BGA | Dotaz |
|
W9425G6KH-4 | Winbond Electronics | IC SDRAM 256MBIT 250MHZ 66TSOP | Dotaz |
|
W9425G6JB-5 | Winbond Electronics | IC SDRAM 256MBIT 200MHZ 60BGA | Dotaz |
|
W9425G6KH-5 TR | Winbond Electronics | IC SDRAM 256MBIT 200MHZ 66TSOP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers