Koupit VCF4-1000 s BYCHPS
Koupit se zárukou
VCF4-1000
- Part Number:
- VCF4-1000
- Popis:
- SOCKET RELAY PC MNT FOR VF4 SER
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16956 Pieces
- Datový list:
- 1.VCF4-1000.pdf2.VCF4-1000.pdf
Úvod
BYCHIPS je distribuční odrůda pro VCF4-1000, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu VCF4-1000 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Socket |
|---|---|
| styl koncovky: | PC Pin |
| Série: | VF4 |
| Ostatní jména: | 1393310-3 PB232 VCF41000 |
| Počet poloh: | 5 |
| Typ montáže: | Through Hole |
| Výrobní standardní doba výroby: | 10 Weeks |
| Výrobní číslo výrobce: | VCF4-1000 |
| Pro použití s / příbuzné výrobky: | VF4-1 and VF4-4 Relays |
| Funkce: | - |
| Rozšířený popis: | Relay Socket Through Hole |
| Popis: | SOCKET RELAY PC MNT FOR VF4 SER |
| Email: | [email protected] |
Související díly pro VCF4-1000
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
2912484 | Phoenix Contact | 14 MM PLC BASIC TERM BLOCK | Dotaz |
 |
P6D-04P | Omron Electronics Inc-EMC Div | RELAY SOCKET PC MNT FOR G6D-ASI | Dotaz |
 |
27E489 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY PC MNT FOR K10 SER | Dotaz |
 |
1904045-1 | TE Connectivity Potter & Brumfield Relays | V23333Z0001A007-EV-000 | Dotaz |
 |
2-1904045-4 | TE Connectivity Potter & Brumfield Relays | V23333Z0002A041-EV-100 | Dotaz |
 |
1-1904045-2 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET HOUSING ISO | Dotaz |
|
3-1904045-3 | TE Connectivity Potter & Brumfield Relays | V23333Z0002A010-EV-311 | Dotaz |
 |
VCF4-1001 | TE Connectivity Potter & Brumfield Relays | HOUSING CONN 5POS FOR VF4 RELAY | Dotaz |
 |
VCF4-1003 | TE Connectivity Potter & Brumfield Relays | CONN FOR QC VF4-2 VF4-5 RELAYS | Dotaz |
 |
VCF4-1002 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY BRKT MNT HARNESS | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers