Koupit UMIL25 s BYCHPS
Koupit se zárukou
UMIL25
- Part Number:
- UMIL25
- Výrobce:
- Microsemi
- Popis:
- TRANS RF BIPO 70W 3A 55HV2
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19363 Pieces
- Datový list:
- UMIL25.pdf
Úvod
BYCHIPS je distribuční odrůda pro UMIL25, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu UMIL25 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 33V |
|---|---|
| Transistor Type: | NPN |
| Dodavatel zařízení Package: | 55HV |
| Série: | - |
| Power - Max: | 70W |
| Obal: | Bulk |
| Paket / krabice: | 55HV |
| Provozní teplota: | 200°C (TJ) |
| Hluk Obrázek (dB Typ @ f): | - |
| Typ montáže: | Chassis Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | UMIL25 |
| Získat: | 8.9db ~ 10dB |
| Frekvence - Přechod: | 225MHz ~ 400MHz |
| Rozšířený popis: | RF Transistor NPN 33V 3A 225MHz ~ 400MHz 70W Chassis Mount 55HV |
| Popis: | TRANS RF BIPO 70W 3A 55HV2 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 10 @ 500mA, 5V |
| Proud - Collector (Ic) (Max): | 3A |
| Email: | [email protected] |
Související díly pro UMIL25
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MDS800 | Microsemi Corporation | TRANS RF BIPO 1458W 60A 55ST1 | Dotaz |
|
BFY90 | Microsemi Corporation | TRANS RF NPN 200MW 50MA TO72 | Dotaz |
 |
HFA3127BZ | Intersil | IC TRANSISTOR ARRAY UHF 16-SOIC | Dotaz |
 |
BFU590GX | NXP USA Inc. | TRANS RF NPN 12V 200MA SOT223-4 | Dotaz |
 |
BFU760F,115 | NXP USA Inc. | TRANS RF NPN 2.8V 70MA SOT343F | Dotaz |
 |
BFG424W,115 | NXP USA Inc. | TRANS NPN 10V 30MA SOT343R | Dotaz |
|
MS2361 | Microsemi Corporation | TRANS RF BIPO 87.5W 2.6A M115 | Dotaz |
 |
BFG520/X,235 | NXP USA Inc. | TRANS RF NPN 9GHZ 15V SOT143B | Dotaz |
|
BFU550XRR | NXP USA Inc. | TRANS RF NPN 12V 50MA SOT-143R | Dotaz |
 |
BFR520,215 | NXP USA Inc. | TRANS NPN 70MA 15V 9GHZ SOT23 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers