Koupit UHE1H560MED1TD s BYCHPS
Koupit se zárukou
UHE1H560MED1TD
- Part Number:
- UHE1H560MED1TD
- Výrobce:
- Nichicon
- Popis:
- CAP ALUM 56UF 50V 20% RADIAL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12782 Pieces
- Datový list:
- 1.UHE1H560MED1TD.pdf2.UHE1H560MED1TD.pdf
Úvod
BYCHIPS je distribuční odrůda pro UHE1H560MED1TD, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu UHE1H560MED1TD e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Ostatní jména: | 493-16224-2 493-16224-2-ND 493-16224-3 Q7987743 UHE1H560MED1TD-ND |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 17 Weeks |
| Výrobní číslo výrobce: | UHE1H560MED1TD |
| Rozšířený popis: | Aluminum Capacitors |
| Popis: | CAP ALUM 56UF 50V 20% RADIAL |
| Email: | [email protected] |
Související díly pro UHE1H560MED1TD
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
UHE1H561MHD6 | Nichicon | CAP ALUM 560UF 20% 50V RADIAL | Dotaz |
 |
UHE1H560MED1TA | Nichicon | CAP ALUM 56UF 20% 50V RADIAL | Dotaz |
 |
UHE1H561MHD | Nichicon | CAP ALUM 560UF 20% 50V RADIAL | Dotaz |
|
UHE1H560MET | Nichicon | CAP ALUM 56UF 20% 50V RADIAL | Dotaz |
|
UHE1H561MHT | Nichicon | CAP ALUM 560UF 20% 50V RADIAL | Dotaz |
|
UHE1H560MED | Nichicon | CAP ALUM 56UF 20% 50V RADIAL | Dotaz |
|
UHE1H561MHD6TN | Nichicon | CAP ALUM 560UF 20% 50V RADIAL | Dotaz |
|
UHE1H561MHD1TO | Nichicon | CAP ALUM 560UF 20% 50V RADIAL | Dotaz |
|
UHE1H561MHT6 | Nichicon | CAP ALUM 560UF 20% 50V RADIAL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers