Koupit TL026CDG4 s BYCHPS
Koupit se zárukou
TL026CDG4
- Part Number:
- TL026CDG4
- Výrobce:
- Popis:
- IC DIFF AMP W/AGC HI-FREQ 8-SOIC
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13910 Pieces
- Datový list:
- TL026CDG4.pdf
Úvod
BYCHIPS je distribuční odrůda pro TL026CDG4, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu TL026CDG4 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Napájení, Single / Dual (±): | ±3 V ~ 8 V |
|---|---|
| Dodavatel zařízení Package: | 8-SOIC |
| rychlost přeběhu: | - |
| Série: | - |
| Obal: | Tube |
| Paket / krabice: | 8-SOIC (0.154", 3.90mm Width) |
| Typ výstupu: | Differential |
| Počet okruhů: | 1 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 2 (1 Year) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | TL026CDG4 |
| Popis: | IC DIFF AMP W/AGC HI-FREQ 8-SOIC |
| Proud - Supply: | 22mA |
| Aktuální - Výstup / Channel: | 4mA |
| Aplikace: | Automatic Gain Control (AGC) |
| -3 dB šířka pásma: | 50MHz |
| Email: | [email protected] |
Související díly pro TL026CDG4
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
EL5524IRE | Intersil | IC BUFFER 4XGAMMA 5.4MA 14HTSSOP | Dotaz |
|
SN10501DR | Texas Instruments | IC VIDEO AMP RR-OUT HS 8-SOIC | Dotaz |
|
TL026CD | Texas Instruments | IC DIFF AMP W/AGC HI-FREQ 8SOIC | Dotaz |
|
TL026CDR | Texas Instruments | IC DIFF AMP W/AGC HI-FREQ 8-SOIC | Dotaz |
|
TL026CPSR | Texas Instruments | IC DIFF AMP W/AGC HI-FREQ 8SO | Dotaz |
 |
EL8108IS-T13 | Intersil | IC AMP VIDEO DISTRIBUTION 8-SOIC | Dotaz |
|
TL026CP | Texas Instruments | IC AGC VIDEO AMP 8DIP | Dotaz |
|
TL026CPG4 | Texas Instruments | IC DIFF AMP W/AGC HI-FREQ 8-DIP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers