Koupit TISP3380F3DR s BYCHPS
Koupit se zárukou
TISP3380F3DR
- Part Number:
- TISP3380F3DR
- Výrobce:
- Bourns, Inc.
- Popis:
- SURGE SUPP 270V BIDIR 8-SOIC
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 17156 Pieces
- Datový list:
- TISP3380F3DR.pdf
Úvod
BYCHIPS je distribuční odrůda pro TISP3380F3DR, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu TISP3380F3DR e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Na státu: | 3V |
|---|---|
| Napětí - Off State: | 270V |
| Napětí - Spínací: | 380V |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 8-CSOIC (0.154", 3.90mm Width) |
| Počet elementů: | 2 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | TISP3380F3DR |
| Popis: | SURGE SUPP 270V BIDIR 8-SOIC |
| Proud - špičkový impuls (8 / 20μs): | 120A |
| Proud - špičkový impuls (10 / 1000μs): | 35A |
| Proud - přidržení (H): | 150mA |
| kapacitní: | 45pF |
| Email: | [email protected] |
Související díly pro TISP3380F3DR
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
TISP3320F3SL | Bourns Inc. | SURGE SUPP 240V BIDIR 3-SL | Dotaz |
|
TISP3380F3SL | Bourns Inc. | SURGE SUPP 270V BIDIR 3-SL | Dotaz |
|
TISP3380F3DR-S | Bourns Inc. | SURGE SUPP 270V BIDIR 8-SOIC | Dotaz |
|
TISP3380F3P | Bourns Inc. | SURGE SUPP 270V BIDIR 8-DIP | Dotaz |
|
TISP3320F3DR-S | Bourns Inc. | DUAL BIDIRECTIONAL PROTECTOR | Dotaz |
|
TISP3070H3SL | Bourns Inc. | SURGE SUPP 58V BIDIR 3-SL | Dotaz |
|
TISP3320F3P | Bourns Inc. | SURGE SUPP 240V BIDIR 8-DIP | Dotaz |
|
TISP3350H3SL | Bourns Inc. | SURGE SUPP 275V BIDIR 3-SL | Dotaz |
|
TISP3320F3DR | Bourns Inc. | SURGE SUPP 240V BIDIR 8-SOIC | Dotaz |
|
TISP3290F3SL | Bourns Inc. | SURGE SUPP 220V BIDIR 3-SL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers