Koupit TDC7200PWR s BYCHPS
Koupit se zárukou
TDC7200PWR
- Part Number:
- TDC7200PWR
- Výrobce:
- Popis:
- IC DIG CONV 14TSSOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18749 Pieces
- Datový list:
- TDC7200PWR.pdf
Úvod
BYCHIPS je distribuční odrůda pro TDC7200PWR, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu TDC7200PWR e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Time to Flight to Digital Converter |
|---|---|
| Dodavatel zařízení Package: | 14-TSSOP |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 14-TSSOP (0.173", 4.40mm Width) |
| Typ výstupu: | Digital |
| Ostatní jména: | 296-44361-2 TDC7200PWR-ND |
| Provozní teplota: | -40°C ~ 85°C |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | TDC7200PWR |
| Rozhraní: | SPI |
| Typ vstupu: | Ultrasound |
| Popis: | IC DIG CONV 14TSSOP |
| Proud - Supply: | 1.35mA |
| Email: | [email protected] |
Související díly pro TDC7200PWR
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
RE46C108S8F | Microchip Technology | IC HORN DRIVER DUAL 8SOIC | Dotaz |
 |
MC145018P | NXP USA Inc. | IC SMOKE DETECT PHOTOELEC 16-DIP | Dotaz |
|
TDC7201ZAXT | Texas Instruments | IC TIME TO DIGITAL CONV 25-NFBGA | Dotaz |
|
PGA308AQDGSRQ1 | Texas Instruments | IC OP AMP AUTO-ZERO SGL 10VSSOP | Dotaz |
|
TDC7200PW | Texas Instruments | IC DIG CONV 14TSSOP | Dotaz |
 |
RE46C165S16F | Microchip Technology | IC PHOTOELECT SMOKE DETECT 16SOI | Dotaz |
|
TDC7201ZAXR | Texas Instruments | IC TIME TO DIGITAL CONV 25-NFBGA | Dotaz |
|
RE46C117S8TF | Microchip Technology | IC HORN DRIVER DUAL 8SOIC | Dotaz |
|
LM9040MX | Texas Instruments | IC AMP DUAL SENSR INTERFC 14SOIC | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers