Koupit TDA8350Q/N6,112 s BYCHPS
Koupit se zárukou
TDA8350Q/N6,112
- Part Number:
- TDA8350Q/N6,112
- Výrobce:
- NXP Semiconductors / Freescale
- Popis:
- IC DC COUPLED V-DEFL 13-SIL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19639 Pieces
- Datový list:
- TDA8350Q/N6,112.pdf
Úvod
BYCHIPS je distribuční odrůda pro TDA8350Q/N6,112, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu TDA8350Q/N6,112 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Dodavatel zařízení Package: | 13-PDBS |
|---|---|
| Série: | * |
| Obal: | Tube |
| Paket / krabice: | 13-SIP Formed Leads |
| Ostatní jména: | 935262194112 TDA8350QU TDA8350QU-ND |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | TDA8350Q/N6,112 |
| Rozšířený popis: | IC 13-PDBS |
| Popis: | IC DC COUPLED V-DEFL 13-SIL |
| Email: | [email protected] |
Související díly pro TDA8350Q/N6,112
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
TDA8395T/N3,112 | NXP USA Inc. | IC DECODER SECAM 20-SOIC | Dotaz |
 |
TDA8356/N6,112 | NXP USA Inc. | IC DC COUPLED V-DEFL 9-SIL | Dotaz |
|
TDA8351/N6,112 | NXP USA Inc. | IC DC COUPLED V-DEFL 9-SIL | Dotaz |
 |
ZLPBLST0H2064GR55W4 | Maxim Integrated | IC OTP RC BLASTER 20-SSOP | Dotaz |
 |
8N3PG10MBKI-161LFT | IDT, Integrated Device Technology Inc | IC SWITCH RIO VFQFPN | Dotaz |
 |
FLC01-200B-TR | STMicroelectronics | IC FIRE LIGHTER CIRCUIT D-PAK | Dotaz |
|
72V51446L6BB | IDT, Integrated Device Technology Inc | IC FLOW CTRL MULTI QUEUE 256-BGA | Dotaz |
 |
PXB 4220 E V3.4-G | Infineon Technologies | IC ATM/IP INTERWORKING BGA-256 | Dotaz |
 |
SLF9630ID1XFSA1 | Infineon Technologies | TRANSPORT&TICKETING | Dotaz |
 |
FM31256-GTR | Cypress Semiconductor Corp | IC MEMORY 14SOIC | Dotaz |
|
DS2401Z+ | Maxim Integrated | IC SILICON SERIAL NUMBER SOT-223 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog