Koupit T050007 s BYCHPS
Koupit se zárukou
T050007
- Part Number:
- T050007
- Výrobce:
- Bourns, Inc.
- Popis:
- GAS DISCHARGE TUBE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14200 Pieces
- Datový list:
- T050007.pdf
Úvod
BYCHIPS je distribuční odrůda pro T050007, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu T050007 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | - |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | T050007 |
| Rozšířený popis: | Gas Discharge Tube Pole |
| Popis: | GAS DISCHARGE TUBE |
| Email: | [email protected] |
Související díly pro T050007
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
2038-110-SMLF | Bourns Inc. | GDT 1100V 25% 5KA SURFACE MOUNT | Dotaz |
 |
B88069X3340S102 | EPCOS (TDK) | GDT 800V THROUGH HOLE | Dotaz |
 |
2026-60-C4LF | Bourns Inc. | GDT 600V 20% 20KA THROUGH HOLE | Dotaz |
 |
T050012 | Bourns Inc. | GAS DISCHARGE TUBE | Dotaz |
|
T050013 | Bourns Inc. | GAS DISCHARGE TUBE | Dotaz |
 |
2046-14-ALF | Bourns Inc. | GDT 145V 20% 10KA | Dotaz |
 |
2015-35-SMC-RPLF | Bourns Inc. | GDT 350V 20% 5KA SURFACE MOUNT | Dotaz |
 |
SL1010A090SM | Littelfuse Inc. | GDT 90V 5KA SURFACE MOUNT | Dotaz |
|
T050014 | Bourns Inc. | GAS DISCHARGE TUBE | Dotaz |
 |
SL1021B350X | Littelfuse Inc. | GDT 350V 20KA THROUGH HOLE | Dotaz |
|
T050006 | Bourns Inc. | GAS DISCHARGE TUBE | Dotaz |
 |
GTCA35-750M-R05 | Littelfuse Inc. | GDT 75V 20% 5KA THROUGH HOLE | Dotaz |
 |
B88069X5470C253 | EPCOS (TDK) | GDT 90V 20% 5KA | Dotaz |
 |
2036-15-BLF | Bourns Inc. | GDT 150V 20% 10KA THROUGH HOLE | Dotaz |
|
T050017 | Bourns Inc. | GAS DISCHARGE TUBE | Dotaz |
|
T050016 | Bourns Inc. | GAS DISCHARGE TUBE | Dotaz |
 |
2028-25-C2LF | Bourns Inc. | GDT 250V 20% 20KA THROUGH HOLE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers