Koupit STGIF7CH60TS-L s BYCHPS
Koupit se zárukou
STGIF7CH60TS-L
- Part Number:
- STGIF7CH60TS-L
- Výrobce:
- ST
- Popis:
- SLLIMM 2ND SERIES IPM, 3-PHASE I
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14412 Pieces
- Datový list:
- STGIF7CH60TS-L.pdf
Úvod
BYCHIPS je distribuční odrůda pro STGIF7CH60TS-L, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu STGIF7CH60TS-L e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Izolace: | 1500Vrms |
|---|---|
| Napětí: | 600V |
| Typ: | IGBT |
| Série: | SLLIMM™ |
| Paket / krabice: | 26-PowerDIP Module (1.134", 28.80mm) |
| Ostatní jména: | 497-16503-5 |
| Výrobní číslo výrobce: | STGIF7CH60TS-L |
| Rozšířený popis: | Power Driver Module IGBT 3 Phase 600V 10A 26-PowerDIP Module (1.134", 28.80mm) |
| Popis: | SLLIMM 2ND SERIES IPM, 3-PHASE I |
| Aktuální: | 10A |
| Konfigurace: | 3 Phase |
| Email: | [email protected] |
Související díly pro STGIF7CH60TS-L
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
STGIF10CH60TS-L | STMicroelectronics | SLLIMM(TM) - 2ND SERIES IPM, 3-P | Dotaz |
 |
APTLGT400A608G | Microsemi Corporation | POWER MOD INTELLIGENT PH LEG LP8 | Dotaz |
 |
STGIF5CH60TS-L | STMicroelectronics | SLLIMM(TM) - 2ND SERIES IPM, 3-P | Dotaz |
 |
FNE41060 | Fairchild/ON Semiconductor | MODULE SPM 600V 10A SPM26AA | Dotaz |
 |
PP150T060 | Powerex Inc. | IGBT ASSEMBLY 3-PHASE 600V 150A | Dotaz |
 |
PS219B3-AS | Powerex Inc. | MOD DIPIPM 10A 600V SUPER MINI | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers