Koupit SSC7102-GQ-AB2 s BYCHPS
Koupit se zárukou
SSC7102-GQ-AB2
- Part Number:
- SSC7102-GQ-AB2
- Výrobce:
- Micrel / Microchip Technology
- Popis:
- SENSOR FUSION HUB
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16932 Pieces
- Datový list:
- 1.SSC7102-GQ-AB2.pdf2.SSC7102-GQ-AB2.pdf
Úvod
BYCHIPS je distribuční odrůda pro SSC7102-GQ-AB2, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu SSC7102-GQ-AB2 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Hub |
|---|---|
| Dodavatel zařízení Package: | 84-TFBGA (6x6) |
| Série: | - |
| Obal: | Tray |
| Paket / krabice: | 84-TFBGA |
| Typ výstupu: | - |
| Provozní teplota: | - |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | SSC7102-GQ-AB2 |
| Rozhraní: | I²C |
| Typ vstupu: | - |
| Popis: | SENSOR FUSION HUB |
| Proud - Supply: | - |
| Email: | [email protected] |
Související díly pro SSC7102-GQ-AB2
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MAX31855RASA+T | Maxim Integrated | IC CONV THERMOCOUPLE-DGTL 8SOIC | Dotaz |
 |
SSC7102-GQ-AB2-TR | Microchip Technology | IC SENSOR HUB LPC 84TFBGA | Dotaz |
 |
SSC7150-ML-AB0 | Microchip Technology | IC SENSOR FUSION HUB 28QFN | Dotaz |
|
SSC7102-GQ-AA0 | Microchip Technology | IC SENSOR FUSION HUB 84TFBGA | Dotaz |
|
SSC7102-GQ-BA0 | Microchip Technology | IC SENSOR FUSION MOVEA 84TFBGA | Dotaz |
|
SSC7102-GQ-AA0-TR | Microchip Technology | IC SENSOR FUSION HUB 84TFBGA | Dotaz |
|
SSC7102-GQ-BA0-TR | Microchip Technology | IC SENSOR FUSION MOVEA 84TFBGA | Dotaz |
 |
RE46C167SW16F | Microchip Technology | IC SMOKE DETECT PHOTO MEM 16SOIC | Dotaz |
 |
AK8998W | AKM Semiconductor Inc. | IC INTERFACE PRESS SENSOR WAFER | Dotaz |
 |
MLX90308LDF-DAA-000-TU | Melexis Technologies NV | IC SENSOR PROG INTERFACE 16-SOIC | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog