Koupit SMPA1304-011LF s BYCHPS
Koupit se zárukou
SMPA1304-011LF
- Part Number:
- SMPA1304-011LF
- Výrobce:
- Skyworks Solutions, Inc.
- Popis:
- DIODE PIN
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18801 Pieces
- Datový list:
- SMPA1304-011LF.pdf
Úvod
BYCHIPS je distribuční odrůda pro SMPA1304-011LF, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu SMPA1304-011LF e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Peak Reverse (Max): | 200V |
|---|---|
| Dodavatel zařízení Package: | SOD-323 |
| Série: | - |
| Odpor při IF, F: | 2 Ohm @ 100mA, 100MHz |
| Ztráta energie (Max): | 250mW |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | SC-76, SOD-323 |
| Ostatní jména: | 863-1690-2 |
| Provozní teplota: | -65°C ~ 150°C (TA) |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | SMPA1304-011LF |
| Rozšířený popis: | RF Diode PIN - Single 200V 250mW SOD-323 |
| Diode Type: | PIN - Single |
| Popis: | DIODE PIN |
| Proud - Max: | - |
| Kapacitní @ Vr, F: | 0.3pF @ 30V, 1MHz |
| Email: | [email protected] |
Související díly pro SMPA1304-011LF
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
BAP55L,315 | NXP USA Inc. | DIODE PIN 50V 100MA SOD-882 | Dotaz |
 |
SMSA7630-061 | Skyworks Solutions Inc. | DIODE SCHOTTKY | Dotaz |
 |
SMPA1320-079LF | Skyworks Solutions Inc. | DIODE PIN | Dotaz |
|
SMPA1302-079LF | Skyworks Solutions Inc. | DIODE PIN | Dotaz |
 |
SMPA1304-019LF | Skyworks Solutions Inc. | SOT 143 PIE ATTENUATOR (THREE CH | Dotaz |
 |
BAR 88-02V E6127 | Infineon Technologies | DIODE PIN SGL 80V 100MA SC-79 | Dotaz |
 |
HSMP-3892-TR1 | Broadcom Limited | DIODE PIN SWITCH 100V 1A SOT-23 | Dotaz |
|
HSMS-2855-TR1G | Broadcom Limited | DIODE SCHOTTKY DETECT SS SOT-143 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers