Koupit SL1122A450R s BYCHPS
Koupit se zárukou
SL1122A450R
- Part Number:
- SL1122A450R
- Výrobce:
- Littelfuse
- Popis:
- GDT 450V 10KA THROUGH HOLE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15660 Pieces
- Datový list:
- SL1122A450R.pdf
Úvod
BYCHIPS je distribuční odrůda pro SL1122A450R, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu SL1122A450R e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - DC Spark Over (nom): | 450V |
|---|---|
| Tolerance: | - |
| Série: | SL1122A |
| Obal: | Tray |
| Paket / krabice: | Radial Cylinder, 3 Lead |
| Počet pólů: | 3 |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | SL1122A450R |
| Impulsní výbojový proud (8 / 20μs): | 10000A (10kA) |
| selhání Short: | No |
| Rozšířený popis: | Gas Discharge Tube 10000A (10kA) 3 Pole Through Hole |
| Popis: | GDT 450V 10KA THROUGH HOLE |
| Email: | [email protected] |
Související díly pro SL1122A450R
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
SL1122A090R | Littelfuse Inc. | GDT 90V 10KA THROUGH HOLE | Dotaz |
|
SL1122A250 | Littelfuse Inc. | GDT 250V 10KA THROUGH HOLE | Dotaz |
|
SL1122A200R | Littelfuse Inc. | GDT 200V 10KA THROUGH HOLE | Dotaz |
|
SL1122A260 | Littelfuse Inc. | GDT 260V 10KA THROUGH HOLE | Dotaz |
|
SL1122A450 | Littelfuse Inc. | GDT 450V 10KA THROUGH HOLE | Dotaz |
|
SL1122A350 | Littelfuse Inc. | GDT 350V 10KA THROUGH HOLE | Dotaz |
|
SL1122A090 | Littelfuse Inc. | GDT 90V 10KA THROUGH HOLE | Dotaz |
|
SL1122A200 | Littelfuse Inc. | GDT 200V 10KA THROUGH HOLE | Dotaz |
 |
SL1122A230 | Littelfuse Inc. | GDT 230V 10KA THROUGH HOLE | Dotaz |
|
SL1122A260R | Littelfuse Inc. | GDT 260V 10KA THROUGH HOLE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers