Koupit SD1224-02 s BYCHPS
Koupit se zárukou
SD1224-02
- Part Number:
- SD1224-02
- Výrobce:
- Microsemi
- Popis:
- TRANS RF BIPO 60W 5A M113
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19892 Pieces
- Datový list:
- SD1224-02.pdf
Úvod
BYCHIPS je distribuční odrůda pro SD1224-02, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu SD1224-02 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 35V |
|---|---|
| Transistor Type: | NPN |
| Dodavatel zařízení Package: | M113 |
| Série: | - |
| Power - Max: | 60W |
| Obal: | Bulk |
| Paket / krabice: | M113 |
| Provozní teplota: | 200°C (TJ) |
| Hluk Obrázek (dB Typ @ f): | - |
| Typ montáže: | Chassis Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | SD1224-02 |
| Získat: | 7.6dB |
| Frekvence - Přechod: | 175MHz |
| Rozšířený popis: | RF Transistor NPN 35V 5A 175MHz 60W Chassis Mount M113 |
| Popis: | TRANS RF BIPO 60W 5A M113 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 500mA, 5V |
| Proud - Collector (Ic) (Max): | 5A |
| Email: | [email protected] |
Související díly pro SD1224-02
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
BFR 360F E6327 | Infineon Technologies | TRANSISTOR RF NPN 6V TSFP-3 | Dotaz |
 |
BFU520YX | NXP USA Inc. | TRANS RF NPN 12V 30MA 6TSSOP | Dotaz |
 |
SD1224 | Microsemi Corporation | TRANS RF BIPO 60W 5A M135 | Dotaz |
 |
MAX2601ESA | Maxim Integrated | IC TRANS 3.6V 1W RF PWR 8-SOIC | Dotaz |
 |
BFG590/X,215 | NXP USA Inc. | TRANS RF NPN 15V 5GHZ SOT143B | Dotaz |
 |
2SC5754-A | CEL | RF TRANSISTOR NPN SOT-343F | Dotaz |
 |
2SC5108-Y,LF | Toshiba Semiconductor and Storage | TRANS RF NPN 10V 1GHZ SSM | Dotaz |
 |
BFR505T,115 | NXP USA Inc. | TRANS NPN 15V 9GHZ SOT-416 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers