Koupit S200-50 s BYCHPS
Koupit se zárukou
S200-50
- Part Number:
- S200-50
- Výrobce:
- Microsemi
- Popis:
- TRANS RF BIPO 110V 30A 55HX
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19192 Pieces
- Datový list:
- S200-50.pdf
Úvod
BYCHIPS je distribuční odrůda pro S200-50, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu S200-50 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 110V |
|---|---|
| Transistor Type: | NPN |
| Dodavatel zařízení Package: | 55HX |
| Série: | - |
| Power - Max: | 320W |
| Obal: | Bulk |
| Paket / krabice: | 55HX |
| Provozní teplota: | 150°C (TJ) |
| Hluk Obrázek (dB Typ @ f): | - |
| Typ montáže: | Chassis Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | S200-50 |
| Získat: | 12dB ~ 14.5dB |
| Frekvence - Přechod: | 1.5MHz ~ 30MHz |
| Rozšířený popis: | RF Transistor NPN 110V 30A 1.5MHz ~ 30MHz 320W Chassis Mount 55HX |
| Popis: | TRANS RF BIPO 110V 30A 55HX |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 10 @ 1A, 5V |
| Proud - Collector (Ic) (Max): | 30A |
| Email: | [email protected] |
Související díly pro S200-50
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MS2441 | Microsemi Corporation | TRANS RF BIPO 1458W 22A M112 | Dotaz |
 |
BFP540ESDE6327HTSA1 | Infineon Technologies | TRANS RF NPN 4.5V ESD SOT-343 | Dotaz |
|
BFP460H6327XTSA1 | Infineon Technologies | TRANS RF NPN 4.5V 70MA SOT343 | Dotaz |
 |
UPA802T-T1-A | CEL | RF DUAL TRANSISTORS NPN SOT-363 | Dotaz |
 |
BFQ19,115 | NXP USA Inc. | TRANS NPN 15V 5.5GHZ SOT89 | Dotaz |
 |
AT-32011-TR1 | Broadcom Limited | IC TRANS NPN BIPOLAR SOT-143 | Dotaz |
|
BFP460H6433XTMA1 | Infineon Technologies | TRANS RF NPN 4.5V 70MA SOT343 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers