Koupit RSE116755 s BYCHPS
Koupit se zárukou
RSE116755
- Part Number:
- RSE116755
- Výrobce:
- Amphenol Pcd
- Popis:
- LOW PROFILE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17807 Pieces
- Datový list:
- RSE116755.pdf
Úvod
BYCHIPS je distribuční odrůda pro RSE116755, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu RSE116755 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 14 Weeks |
| Výrobní číslo výrobce: | RSE116755 |
| Rozšířený popis: | Relay |
| Popis: | LOW PROFILE |
| Email: | [email protected] |
Související díly pro RSE116755
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
RSE116755-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Dotaz |
|
RSE116760-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Dotaz |
|
RSE116746 | Amphenol PCD | LOW PROFILE, 3 POLE/10 AMP, LC | Dotaz |
|
RSE116753-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Dotaz |
|
RSE116763-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Dotaz |
|
RSE116754 | Amphenol PCD | LOW PROFILE | Dotaz |
|
RSE116702-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Dotaz |
|
RSE116700 | Amphenol PCD | LOW PROFILE, 2 POLE/10 AMP, LC | Dotaz |
|
RSE116761 | Amphenol PCD | LOW PROFILE, 6 POLE/10 AMP, WC | Dotaz |
|
RSE116701-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Dotaz |
|
RSE116703 | Amphenol PCD | LOW PROFILE, 2 POLE/10 AMP, WC | Dotaz |
|
RSE116754-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Dotaz |
|
RSE116748 | Amphenol PCD | LOW PROFILE, 3 POLE/10 AMP, LC | Dotaz |
|
RSE116749 | Amphenol PCD | LOW PROFILE, 3 POLE/10 AMP, WC | Dotaz |
|
RSE116703-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Dotaz |
|
RSE116749-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers