Koupit PP300B120 s BYCHPS
Koupit se zárukou
PP300B120
- Part Number:
- PP300B120
- Výrobce:
- Powerex, Inc.
- Popis:
- IGBT ASSY 3-PHASE 1200V 300A
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 14842 Pieces
- Datový list:
- PP300B120.pdf
Úvod
BYCHIPS je distribuční odrůda pro PP300B120, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu PP300B120 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Izolace: | 2500VDC |
|---|---|
| Napětí: | 1200V |
| Typ: | IGBT |
| Série: | - |
| Paket / krabice: | Power Module |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | PP300B120 |
| Rozšířený popis: | Power Driver Module IGBT H-Bridge Inverter 1200V 300A Power Module |
| Popis: | IGBT ASSY 3-PHASE 1200V 300A |
| Aktuální: | 300A |
| Konfigurace: | H-Bridge Inverter |
| Email: | [email protected] |
Související díly pro PP300B120
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
PP300T060 | Powerex Inc. | IGBT ASSEMBLY 3-PHASE 600V 300A | Dotaz |
 |
FSB50825US | Fairchild/ON Semiconductor | IC POWER MOD SPM 250V 4A SPM23BD | Dotaz |
|
PP300D060 | Powerex Inc. | IGBT ASSY H-BRIDGE 600V 300A | Dotaz |
|
PP300B060 | Powerex Inc. | IGBT ASSY H-BRIDGE 600V 300A | Dotaz |
 |
FNB40560 | Fairchild/ON Semiconductor | MOD SPM 600V 5A SPM26-AA | Dotaz |
|
PP300D120 | Powerex Inc. | IGBT ASSY HBRIDGE 1200V 300A | Dotaz |
 |
IRAMS10UP60A | Infineon Technologies | IC MOD PWR INTELLIGENT 10A 600V | Dotaz |
|
PP300T120 | Powerex Inc. | IGBT ASSEMBLY 3PHASE 1200V 300A | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers