Koupit PM600-02 s BYCHPS
Koupit se zárukou
PM600-02
- Part Number:
- PM600-02
- Výrobce:
- Bourns, Inc.
- Popis:
- INDUCT ARRAY 6 COIL 89.6UH SMD
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 17716 Pieces
- Datový list:
- PM600-02.pdf
Úvod
BYCHIPS je distribuční odrůda pro PM600-02, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu PM600-02 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | PM600 |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | PM600-02 |
| Rozšířený popis: | Coil Inductor Array Inductance - Connected in Series Inductance - Connected in Parallel DC Resistance (DCR) - Parallel |
| Popis: | INDUCT ARRAY 6 COIL 89.6UH SMD |
| Email: | [email protected] |
Související díly pro PM600-02
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
PM600-02-RC | Bourns Inc. | INDUCT ARRAY 6 COIL 89.6UH SMD | Dotaz |
|
PM600-01 | Bourns Inc. | INDUCT ARRAY 6 COIL 201.6UH SMD | Dotaz |
|
PM600-04 | Bourns Inc. | INDUCT ARRAY 6 COIL 12.2UH SMD | Dotaz |
|
PM600-01-RC | Bourns Inc. | INDUCT ARRAY 6 COIL 201.6UH SMD | Dotaz |
|
PM600-03-RC | Bourns Inc. | INDUCT ARRAY 6 COIL 27.4UH SMD | Dotaz |
|
PM600-04-RC | Bourns Inc. | INDUCT ARRAY 6 COIL 12.2UH SMD | Dotaz |
|
PM600-01-B | Bourns Inc. | INDUCT ARRAY 6 COIL 201.6UH SMD | Dotaz |
|
PM600-04-B | Bourns Inc. | INDUCT ARRAY 6 COIL 12.2UH SMD | Dotaz |
|
PM600-08-RC | Bourns Inc. | FIXED IND 4.9UH 710MA 137 MOHM | Dotaz |
|
PM600-03 | Bourns Inc. | INDUCT ARRAY 6 COIL 27.4UH SMD | Dotaz |
|
PM600-02-B | Bourns Inc. | INDUCT ARRAY 6 COIL 89.6UH SMD | Dotaz |
|
PM600-03-B | Bourns Inc. | INDUCT ARRAY 6 COIL 27.4UH SMD | Dotaz |
 |
SRF1260-470M | Bourns Inc. | INDUCT ARRAY 2 COIL 47UH SMD | Dotaz |
|
PM600-10-RC | Bourns Inc. | INDUCT ARRAY 6 COIL 3.8UH SMD | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers