Koupit PGFM-111-B-A1-188 s BYCHPS
Koupit se zárukou
PGFM-111-B-A1-188
- Part Number:
- PGFM-111-B-A1-188
- Výrobce:
- Sensata Technologies, Airpax
- Popis:
- GROUND FAULT PROTECTION MODULE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17320 Pieces
- Datový list:
- PGFM-111-B-A1-188.pdf
Úvod
BYCHIPS je distribuční odrůda pro PGFM-111-B-A1-188, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu PGFM-111-B-A1-188 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Sensing Module |
|---|---|
| Specifikace: | 120V |
| Série: | PGFM |
| Ostatní jména: | Q4973984 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | PGFM-111-B-A1-188 |
| Popis: | GROUND FAULT PROTECTION MODULE |
| Email: | [email protected] |
Související díly pro PGFM-111-B-A1-188
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
PGFM-111-B-A1-188A | Sensata Technologies/Airpax | GROUND FAULT PROTECTION MODULE | Dotaz |
|
PGFM-211-B-A2-188 | Sensata Technologies/Airpax | GROUND FAULT PROTECTION MODULE | Dotaz |
|
PGFM-211-B-A1-138A | Sensata Technologies/Airpax | GROUND FAULT PROTECTION MODULE | Dotaz |
|
PGFM-211-B-A1 | Sensata Technologies/Airpax | GROUND FAULT PROTECTION MODULE | Dotaz |
|
PGFM-211-B-A1-188 | Sensata Technologies/Airpax | GROUND FAULT PROTECTION MODULE | Dotaz |
|
PGFM-211-B-A1-188A | Sensata Technologies/Airpax | GROUND FAULT PROTECTION MODULE | Dotaz |
|
PGFM-111-B-A1-138A | Sensata Technologies/Airpax | GROUND FAULT PROTECTION MODULE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers