Koupit PC28F320C3BD70A s BYCHPS
Koupit se zárukou
PC28F320C3BD70A
- Part Number:
- PC28F320C3BD70A
- Výrobce:
- Micron Technology
- Popis:
- IC FLASH 32MBIT 70NS 64EASYBGA
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16354 Pieces
- Datový list:
- PC28F320C3BD70A.pdf
Úvod
BYCHIPS je distribuční odrůda pro PC28F320C3BD70A, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu PC28F320C3BD70A e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Dodavatel zařízení Package: | 64-EasyBGA (10x13) |
| Rychlost: | 70ns |
| Série: | - |
| Obal: | Tray |
| Paket / krabice: | 64-TBGA |
| Ostatní jména: | 865363 PC28F320C3BD70 |
| Provozní teplota: | -40°C ~ 85°C (TA) |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Typ paměti: | Non-Volatile |
| Velikost paměti: | 32Mb (2M x 16) |
| Formát paměti: | FLASH |
| Výrobní číslo výrobce: | PC28F320C3BD70A |
| Rozhraní: | Parallel |
| Popis: | IC FLASH 32MBIT 70NS 64EASYBGA |
| Email: | [email protected] |
Související díly pro PC28F320C3BD70A
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
PC28F320J3D75E | Micron Technology Inc. | IC FLASH 32MBIT 75NS 64EASYBGA | Dotaz |
 |
PC28F320J3F75B TR | Micron Technology Inc. | IC FLASH 32MBIT 75NS 64EASYBGA | Dotaz |
|
PC28F320J3F75D TR | Micron Technology Inc. | IC FLASH 32MBIT 75NS 64EASYBGA | Dotaz |
|
PC28F320J3F75A | Micron Technology Inc. | IC FLASH 32MBIT 75NS 64EASYBGA | Dotaz |
|
PC28F320J3D75D TR | Micron Technology Inc. | IC FLASH 32MBIT 75NS 64EASYBGA | Dotaz |
|
PC28F320J3F75E | Micron Technology Inc. | IC FLASH 32MBIT 75NS 64EASYBGA | Dotaz |
|
PC28F320J3D75A | Micron Technology Inc. | IC FLASH 32MBIT 75NS 64EASYBGA | Dotaz |
|
PC28F320J3D75B TR | Micron Technology Inc. | IC FLASH 32MBIT 75NS 64EASYBGA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers