Koupit NRV3012T1R5N s BYCHPS
Koupit se zárukou
NRV3012T1R5N
- Part Number:
- NRV3012T1R5N
- Výrobce:
- Taiyo Yuden
- Popis:
- INDUCTOR,LOW PROFILE WOUND,10UH2
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19204 Pieces
- Datový list:
- NRV3012T1R5N.pdf
Úvod
BYCHIPS je distribuční odrůda pro NRV3012T1R5N, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu NRV3012T1R5N e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Obal: | Tape & Reel (TR) |
| Ostatní jména: | 587-5474-2 LM NRV3012T 1R5N |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 5 Weeks |
| Výrobní číslo výrobce: | NRV3012T1R5N |
| Rozšířený popis: | Inductor |
| Popis: | INDUCTOR,LOW PROFILE WOUND,10UH2 |
| Email: | [email protected] |
Související díly pro NRV3012T1R5N
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
GLFR2012T470M-LR | TDK Corporation | FIXED IND 47UH 230MA 1.38 OHM | Dotaz |
 |
VLS201610ET-1R5N-CA | TDK Corporation | FIXED IND 1.5UH 1.15A 181 MOHM | Dotaz |
 |
NRV3012T2R2M | Taiyo Yuden | FIXED IND 2.2UH 1.1A 120 MOHM | Dotaz |
 |
PTHF75R-50H | API Delevan Inc. | FIXED IND 75UH 3.47A 45 MOHM TH | Dotaz |
|
NRV3012T1R0N | Taiyo Yuden | FIXED IND 1UH 1.6A 65 MOHM SMD | Dotaz |
|
1537-02K | API Delevan Inc. | FIXED IND 220NH 2.02A 55 MOHM TH | Dotaz |
 |
NLCV25T-150K-PFD | TDK Corporation | FIXED IND 15UH 175MA 2.86 OHM | Dotaz |
 |
SRR1260-470Y | Bourns Inc. | FIXED IND 47UH 2.6A 86 MOHM SMD | Dotaz |
 |
CDR6D28MNNP-7R7NC | Sumida America Components Inc. | FIXED IND 7.7UH 2A 76.3 MOHM SMD | Dotaz |
 |
NRV3012T100M | Taiyo Yuden | INDUCTOR,LOW PROFILE WOUND,6.8UH | Dotaz |
 |
RCP1317NP-121L | Sumida America Components Inc. | FIXED IND 120UH 2.2A 139 MOHM TH | Dotaz |
 |
SRR5018-330Y | Bourns Inc. | FIXED IND 33UH 650MA 350 MOHM | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers