Koupit NLV74HCT573ADTRG s BYCHPS
Koupit se zárukou
NLV74HCT573ADTRG
- Part Number:
- NLV74HCT573ADTRG
- Popis:
- IC TXRX/LATCH OCTAL 3ST 20-TSSOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16719 Pieces
- Datový list:
- NLV74HCT573ADTRG.pdf
Úvod
BYCHIPS je distribuční odrůda pro NLV74HCT573ADTRG, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu NLV74HCT573ADTRG e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | 74HCT |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 5 Weeks |
| Výrobní číslo výrobce: | NLV74HCT573ADTRG |
| Rozšířený popis: | Element Bit per Element Output |
| Popis: | IC TXRX/LATCH OCTAL 3ST 20-TSSOP |
| Email: | [email protected] |
Související díly pro NLV74HCT573ADTRG
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
NLV74HCT573ADWG | ON Semiconductor | IC TXRX OCTAL 3-STATE 20SOIC | Dotaz |
|
NLV74HCT573ADWRG | ON Semiconductor | IC TXRX OCTAL 3-STATE 20SOIC | Dotaz |
|
NLV74VHCT14ADTR2G | ON Semiconductor | IC INVERTER HEX TSSOP | Dotaz |
|
NLV74AC32DR2G | ON Semiconductor | IC FLIP FLOP CMOS D 14SOIC | Dotaz |
|
NLV74HCT574ADWG | ON Semiconductor | IC FLIP FLOP NONINVERTING 20SOIC | Dotaz |
 |
NLV74HCT574ADTRG | ON Semiconductor | IC FLIP FLOP OCT D 3ST 20-TSSOP | Dotaz |
|
NLV74HCT574ADWRG | ON Semiconductor | IC FLIP FLOP NONINVERTING 20SOIC | Dotaz |
|
NLV74HC1G00DTT1G | ON Semiconductor | IC GATE OR 2INPUT CMOS 5TSOP | Dotaz |
 |
NLV74VHC1G08DTT1G | ON Semiconductor | IC GATE AND CMOS 5TSOP | Dotaz |
|
NLV74HCT541ADTRG | ON Semiconductor | IC BUFF/DVR TRI-ST 8BIT 20TSSOP | Dotaz |
|
NLV74HCT541ADWRG | ON Semiconductor | IC BUFF/DVR TRI-ST 8BIT 20SOIC | Dotaz |
|
NLV74HCT541ADWG | ON Semiconductor | IC BUFF/DVR TRI-ST 8BIT 20SOIC | Dotaz |
|
NLV74HCU04ADG | ON Semiconductor | IC INVERTER HEX 14SOIC | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers