Koupit NCT5605Y s BYCHPS
Koupit se zárukou
NCT5605Y
- Part Number:
- NCT5605Y
- Popis:
- IC LPC GP I/O SMBUS 20QFN
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16485 Pieces
- Datový list:
- NCT5605Y.pdf
Úvod
BYCHIPS je distribuční odrůda pro NCT5605Y, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu NCT5605Y e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 3.3V |
|---|---|
| Dodavatel zařízení Package: | 20-QFN (4x4) |
| Série: | - |
| Obal: | Tray |
| Paket / krabice: | 20-WFQFN Exposed Pad |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní standardní doba výroby: | 12 Weeks |
| Výrobní číslo výrobce: | NCT5605Y |
| Rozhraní: | - |
| Rozšířený popis: | Controller Interface 20-QFN (4x4) |
| Popis: | IC LPC GP I/O SMBUS 20QFN |
| Aplikace: | Controller |
| Email: | [email protected] |
Související díly pro NCT5605Y
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
PCA9518D,112 | NXP USA Inc. | IC I2C HUB 5CH EXPANDBL 20-SOIC | Dotaz |
 |
MAX3783UCM+D | Maxim Integrated | IC MUX/BUFF DUAL 2.7GBPS 48TQFP | Dotaz |
 |
LMH0074SQX/NOPB | Texas Instruments | IC ADAPT CBL EQUALIZER 16WQFN | Dotaz |
|
TUSB9261IPAPQ1 | Texas Instruments | IC BRIDGE USB TO SATA 64HTQFP | Dotaz |
 |
PI7C9X2G304ELZXAEX | Diodes Incorporated | IC PCIE PACKET SWITCH QFN | Dotaz |
 |
89H12NT12G2ZAHL | IDT, Integrated Device Technology Inc | IC PCI SW 12LANE 12PORT 324BGA | Dotaz |
|
PCA9548APW,118 | NXP USA Inc. | IC I2C SWITCH 8CH 24TSSOP | Dotaz |
|
89H16T4BG2ZBBXGI8 | IDT, Integrated Device Technology Inc | IC PCI SW 16LANE 4PORT 288BGA | Dotaz |
 |
89HPES24T3G2ZBALG8 | IDT, Integrated Device Technology Inc | IC PCI SW 24LANE 3PORT 324-FCBGA | Dotaz |
 |
USB3280-AEZG-TR | Microchip Technology | IC TXRX USB 2.0 36QFN | Dotaz |
|
LM93CIMT/NOPB | Texas Instruments | IC HARDWARE MONITOR 56-TSSOP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers