Koupit N74F242N,602 s BYCHPS
Koupit se zárukou
N74F242N,602
- Part Number:
- N74F242N,602
- Výrobce:
- NXP Semiconductors / Freescale
- Popis:
- IC BUS TXRX TRI-ST 4BIT 14DIP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14373 Pieces
- Datový list:
- N74F242N,602.pdf
Úvod
BYCHIPS je distribuční odrůda pro N74F242N,602, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu N74F242N,602 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 4.5 V ~ 5.5 V |
|---|---|
| Dodavatel zařízení Package: | 14-DIP |
| Série: | 74F |
| Obal: | Tube |
| Paket / krabice: | 14-DIP (0.300", 7.62mm) |
| Typ výstupu: | Push-Pull |
| Ostatní jména: | 568-3172-5 933731250602 N74F242N |
| Provozní teplota: | 0°C ~ 70°C (TA) |
| Počet elementů: | 1 |
| Počet bitů na Element: | 4 |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | N74F242N,602 |
| Typ logiky: | Transceiver, Inverting |
| Typ vstupu: | - |
| Rozšířený popis: | Transceiver, Inverting Element 4 Bit per Element Push-Pull Output 14-DIP |
| Popis: | IC BUS TXRX TRI-ST 4BIT 14DIP |
| Aktuální - Výstup High, Low: | 15mA, 64mA |
| Email: | [email protected] |
Související díly pro N74F242N,602
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
N74F242D,623 | NXP USA Inc. | IC BUS TXRX TRI-ST 4BIT 14SOIC | Dotaz |
 |
N74F241N,602 | NXP USA Inc. | IC BUFFER TRI-ST NON-INV 20DIP | Dotaz |
 |
N74F244D,623 | NXP USA Inc. | IC BUFF/DVR TRI-ST DUAL 20SOIC | Dotaz |
|
N74F241D,623 | NXP USA Inc. | IC BUFFER TRI-ST NON-INV 20SOIC | Dotaz |
|
N74F242D,602 | NXP USA Inc. | IC BUS TXRX TRI-ST 4BIT 14SOIC | Dotaz |
|
N74F244D,602 | NXP USA Inc. | IC BUFF/DVR TRI-ST DUAL 20SOIC | Dotaz |
|
N74F243D,623 | NXP USA Inc. | IC BUS TRANSCVR 3-ST 4BIT 14SOIC | Dotaz |
|
N74F245D,623 | NXP USA Inc. | IC TRANSCVR TRI-ST 8BIT 20SOIC | Dotaz |
|
N74F244DB,112 | NXP USA Inc. | IC BUFF/DVR TRI-ST DUAL 20SSOP | Dotaz |
|
N74F245N,602 | NXP USA Inc. | IC TRANSCVR TRI-ST 8BIT 20DIP | Dotaz |
|
N74F240D,623 | NXP USA Inc. | IC BUFF INVERT 8BIT 5.5V 20SOIC | Dotaz |
 |
N74F243N,602 | NXP USA Inc. | IC BUS TRANSCVR 3-ST 4BIT 14DIP | Dotaz |
|
N74F240N,602 | NXP USA Inc. | IC BUFF INVERT 8BIT 5.5V 20DIP | Dotaz |
|
N74F243D,602 | NXP USA Inc. | IC BUS TRANSCVR 3-ST 4BIT 14SOIC | Dotaz |
|
N74F240D,602 | NXP USA Inc. | IC BUFF INVERT 8BIT 5.5V 20SOIC | Dotaz |
|
N74F244BN,602 | NXP USA Inc. | IC BUFF/DVR TRI-ST DUAL 20DIP | Dotaz |
|
N74F244BD,602 | NXP USA Inc. | IC BUFF/DVR TRI-ST DUAL 20SOIC | Dotaz |
|
N74F244BD,623 | NXP USA Inc. | IC BUFF/DVR TRI-ST DUAL 20SOIC | Dotaz |
|
N74F244N,602 | NXP USA Inc. | IC BUFF/DVR TRI-ST DUAL 20DIP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers