Koupit MT3S20TU(TE85L) s BYCHPS
Koupit se zárukou
MT3S20TU(TE85L)
- Part Number:
- MT3S20TU(TE85L)
- Výrobce:
- Toshiba Semiconductor
- Popis:
- TRANS RF NPN 7GHZ 80MA UFM
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12104 Pieces
- Datový list:
- MT3S20TU(TE85L).pdf
Úvod
BYCHIPS je distribuční odrůda pro MT3S20TU(TE85L), máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MT3S20TU(TE85L) e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 12V |
|---|---|
| Transistor Type: | NPN |
| Dodavatel zařízení Package: | UFM |
| Série: | - |
| Power - Max: | 900mW |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 3-SMD, Flat Leads |
| Ostatní jména: | MT3S20TU (TE85L) MT3S20TU(TE85L)TR MT3S20TUTE85L |
| Provozní teplota: | 150°C (TJ) |
| Hluk Obrázek (dB Typ @ f): | 1.45dB @ 20mA, 5V |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | MT3S20TU(TE85L) |
| Získat: | 12dB |
| Frekvence - Přechod: | 7GHz |
| Rozšířený popis: | RF Transistor NPN 12V 80mA 7GHz 900mW Surface Mount UFM |
| Popis: | TRANS RF NPN 7GHZ 80MA UFM |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 100 @ 50mA, 5V |
| Proud - Collector (Ic) (Max): | 80mA |
| Email: | [email protected] |
Související díly pro MT3S20TU(TE85L)
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MT3S20P(TE12L,F) | Toshiba Semiconductor and Storage | TRANS RF NPN 12V 1GHZ PW-MINI | Dotaz |
 |
UPA810T-T1-A | CEL | RF DUAL TRANSISTORS NPN SOT-363 | Dotaz |
 |
MRF553G | Microsemi Corporation | TRANS NPN 16V 500MA POWERMACRO | Dotaz |
 |
2SC5088-O(TE85L,F) | Toshiba Semiconductor and Storage | TRANS RF NPN 12V 500MHZ USQ | Dotaz |
 |
MPSH17G | ON Semiconductor | TRANS NPN RF SS 15V TO92 | Dotaz |
 |
NE68719-T1 | CEL | TRANS NPN 2GHZ SMD | Dotaz |
 |
MPSH17_D26Z | Fairchild/ON Semiconductor | TRANS NPN 15V TO-92 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers