Koupit MS2267 s BYCHPS
Koupit se zárukou
MS2267
- Part Number:
- MS2267
- Výrobce:
- Microsemi
- Popis:
- TRANS RF BIPO 575W 20A M214
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12747 Pieces
- Datový list:
- MS2267.pdf
Úvod
BYCHIPS je distribuční odrůda pro MS2267, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MS2267 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 60V |
|---|---|
| Transistor Type: | NPN |
| Dodavatel zařízení Package: | M214 |
| Série: | - |
| Power - Max: | 575W |
| Obal: | Bulk |
| Paket / krabice: | M214 |
| Provozní teplota: | 250°C (TJ) |
| Hluk Obrázek (dB Typ @ f): | - |
| Typ montáže: | Chassis Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | MS2267 |
| Získat: | 8dB ~ 8.7dB |
| Frekvence - Přechod: | 960MHz ~ 1.215GHz |
| Rozšířený popis: | RF Transistor NPN 60V 20A 960MHz ~ 1.215GHz 575W Chassis Mount M214 |
| Popis: | TRANS RF BIPO 575W 20A M214 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 10 @ 1A, 5V |
| Proud - Collector (Ic) (Max): | 20A |
| Email: | [email protected] |
Související díly pro MS2267
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
BFP720FESDH6327XTSA1 | Infineon Technologies | TRANS RF NPN 45GHZ 4.7V TSFP-4 | Dotaz |
 |
AT-41511-BLKG | Broadcom Limited | TRANS NPN BIPO 12V 50MA SOT-143 | Dotaz |
 |
2SA1978-A | CEL | RF TRANSISTOR PNP SOT-23 | Dotaz |
|
UPA895TS-A | CEL | TRANSISTOR NPN DUAL 6-SMINI | Dotaz |
 |
START405TR | STMicroelectronics | TRANS RF NPN SILICON SOT-343 | Dotaz |
 |
BFG591,115 | NXP USA Inc. | TRANS NPN 15V 7GHZ SOT-223 | Dotaz |
|
UPA800T-T1 | CEL | TRANS NPN HF FT=8GHZ SOT-363 | Dotaz |
 |
BFR 182T E6327 | Infineon Technologies | TRANSISTOR RF NPN 12V SC-75 | Dotaz |
 |
BF959 | ON Semiconductor | TRANS RF NPN 20V 100MA TO-92 | Dotaz |
 |
NE46234-T1-AZ | CEL | RF TRANSISTOR NPN SOT-89 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers