Koupit MS1076 s BYCHPS
Koupit se zárukou
MS1076
- Part Number:
- MS1076
- Výrobce:
- Microsemi
- Popis:
- TRANS RF BIPO 320W 16A M174
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17239 Pieces
- Datový list:
- MS1076.pdf
Úvod
BYCHIPS je distribuční odrůda pro MS1076, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MS1076 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 35V |
|---|---|
| Transistor Type: | NPN |
| Dodavatel zařízení Package: | M174 |
| Série: | - |
| Power - Max: | 320W |
| Obal: | Bulk |
| Paket / krabice: | M174 |
| Provozní teplota: | 200°C (TJ) |
| Hluk Obrázek (dB Typ @ f): | - |
| Typ montáže: | Chassis Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | MS1076 |
| Získat: | 12dB |
| Frekvence - Přechod: | 30MHz |
| Rozšířený popis: | RF Transistor NPN 35V 16A 30MHz 320W Chassis Mount M174 |
| Popis: | TRANS RF BIPO 320W 16A M174 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 15 @ 7A, 5V |
| Proud - Collector (Ic) (Max): | 16A |
| Email: | [email protected] |
Související díly pro MS1076
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
FH102A-TR-E | ON Semiconductor | TRANS NPN DUAL 10V 70MA MCP6 | Dotaz |
 |
2SC5007-T1-A | CEL | RF TRANSISTOR NPN SOT-523 | Dotaz |
 |
BFR93AW,115 | NXP USA Inc. | TRANS NPN 12V 35MA 5GHZ SOT323 | Dotaz |
 |
NE85618-T1-A | CEL | RF TRANSISTOR NPN SOT-343 | Dotaz |
 |
HFA3128R96 | Intersil | IC TRANS ARRAY 5X PND 16QFN | Dotaz |
 |
BFP 740F E6327 | Infineon Technologies | TRANSISTOR RF NPN 30MA TSFP-4 | Dotaz |
 |
2SC4808J0L | Panasonic Electronic Components | TRANS NPN 10VCEO 80MA SSMINI-3 | Dotaz |
|
2SC4627J0L | Panasonic Electronic Components | TRANS NPN HF 20VCEO 15MA SS-MINI | Dotaz |
 |
MPSH10RLRPG | ON Semiconductor | TRANS NPN VHF/UHF SS 25V TO-92 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers