Koupit MMVL3700T1G s BYCHPS
Koupit se zárukou
MMVL3700T1G
- Part Number:
- MMVL3700T1G
- Popis:
- DIODE PIN SWITCHING 200V SOD-323
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12556 Pieces
- Datový list:
- MMVL3700T1G.pdf
Úvod
BYCHIPS je distribuční odrůda pro MMVL3700T1G, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MMVL3700T1G e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Peak Reverse (Max): | 200V |
|---|---|
| Dodavatel zařízení Package: | SOD-323 |
| Série: | - |
| Odpor při IF, F: | 1 Ohm @ 10mA, 100MHz |
| Ztráta energie (Max): | 200mW |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | SC-76, SOD-323 |
| Provozní teplota: | 150°C (TJ) |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | MMVL3700T1G |
| Rozšířený popis: | RF Diode PIN - Single 200V 20mA 200mW SOD-323 |
| Diode Type: | PIN - Single |
| Popis: | DIODE PIN SWITCHING 200V SOD-323 |
| Proud - Max: | 20mA |
| Kapacitní @ Vr, F: | 1pF @ 20V, 1MHz |
| Email: | [email protected] |
Související díly pro MMVL3700T1G
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
BAR6302WH6327XTSA1 | Infineon Technologies | DIODE RF SW 50V 100MA SCD80 | Dotaz |
 |
MMVL3401T1 | ON Semiconductor | DIODE PIN SWITCHING 35V SOD-323 | Dotaz |
|
MMVL3700T1 | ON Semiconductor | DIODE PIN SWITCHING 200V SOD-323 | Dotaz |
 |
BAR 64-02LRH E6433 | Infineon Technologies | DIODE RF SGL 150V 100MA TSLP2-7 | Dotaz |
|
MMVL3401T1G | ON Semiconductor | DIODE PIN SWITCHING 35V SOD-323 | Dotaz |
 |
HSMP-4810-BLKG | Broadcom Limited | DIODE PIN ATTENUATOR HF SOT-23 | Dotaz |
 |
BAR6403WE6327HTSA1 | Infineon Technologies | DIODE RF SGL 150V 100MA SOD-323 | Dotaz |
 |
BAP65-05W,115 | NXP USA Inc. | DIODE PIN 30V 100MA SOT323 | Dotaz |
|
MMVL3102T1G | ON Semiconductor | DIODE TUNING 30V SOD-323 | Dotaz |
 |
DMV1500MFD | STMicroelectronics | DIODE DAMPER/MOD VIDEO TO220FPAB | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers