Koupit MJE13007 s BYCHPS
Koupit se zárukou
MJE13007
- Part Number:
- MJE13007
- Popis:
- TRANS NPN 400V 8A TO220AB
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 12017 Pieces
- Datový list:
- MJE13007.pdf
Úvod
BYCHIPS je distribuční odrůda pro MJE13007, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MJE13007 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 400V |
|---|---|
| VCE Saturation (Max) @ IB, IC: | 3V @ 2A, 8A |
| Transistor Type: | NPN |
| Dodavatel zařízení Package: | TO-220AB |
| Série: | SWITCHMODE™ |
| Power - Max: | 80W |
| Obal: | Tube |
| Paket / krabice: | TO-220-3 |
| Ostatní jména: | MJE13007OS |
| Provozní teplota: | -65°C ~ 150°C (TJ) |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | MJE13007 |
| Frekvence - Přechod: | 14MHz |
| Rozšířený popis: | Bipolar (BJT) Transistor NPN 400V 8A 14MHz 80W Through Hole TO-220AB |
| Popis: | TRANS NPN 400V 8A TO220AB |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 5 @ 5A, 5V |
| Aktuální - sběratel Cutoff (Max): | 100µA |
| Proud - Collector (Ic) (Max): | 8A |
| Email: | [email protected] |
Související díly pro MJE13007
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MJE13005G | ON Semiconductor | TRANS NPN 400V 4A TO220AB | Dotaz |
|
MJE13005 | ON Semiconductor | TRANS NPN 400V 4A TO220AB | Dotaz |
|
MJE13009G | ON Semiconductor | TRANS NPN 400V 12A TO220AB | Dotaz |
|
MJE13007G | ON Semiconductor | TRANS NPN 400V 8A TO220AB | Dotaz |
 |
MJE13003G | ON Semiconductor | TRANS NPN 400V 1.5A TO-225 | Dotaz |
|
MJE13009 | ON Semiconductor | TRANS NPN 400V 12A TO220AB | Dotaz |
|
MJE13003 | ON Semiconductor | TRANS NPN 400V 1.5A TO225 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers