Koupit MCO800-18IO1 s BYCHPS
Koupit se zárukou
MCO800-18IO1
- Part Number:
- MCO800-18IO1
- Výrobce:
- IXYS Corporation
- Popis:
- SCR THYRISTOR SGL 1800V WC-800
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16864 Pieces
- Datový list:
- MCO800-18IO1.pdf
Úvod
BYCHIPS je distribuční odrůda pro MCO800-18IO1, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MCO800-18IO1 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Off State: | 1800V |
|---|---|
| Struktura: | Single |
| Série: | - |
| Obal: | Tray |
| Paket / krabice: | WC-800 |
| Provozní teplota: | - |
| Počet SCR, diody: | 1 SCR |
| Typ montáže: | Chassis Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | MCO800-18IO1 |
| Rozšířený popis: | SCR Module 1800V Single Chassis Mount WC-800 |
| Popis: | SCR THYRISTOR SGL 1800V WC-800 |
| Proud - Na státu (It (RMS)) (Max): | - |
| Proud -. Non Rep Surge 50, 60 Hz (ITSM): | - |
| Email: | [email protected] |
Související díly pro MCO800-18IO1
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
IRKL56/16A | Vishay Semiconductor Diodes Division | SCR DBL HISCR 1600V 60A ADDAPAK | Dotaz |
 |
B512F-2 | Crydom Co. | MOD DIODE SCR 25A 240VAC ISO QC | Dotaz |
 |
MCC312-18IO1 | IXYS | MOD THYRISTOR DUAL 1800V Y1-CU | Dotaz |
|
MCO800-14IO1 | IXYS | SCR THYRISTOR SGL 1400V WC-800 | Dotaz |
|
IRKT56/16A | Vishay Semiconductor Diodes Division | SCR DBL 2SCR 1600V 60A ADD-A-PAK | Dotaz |
|
MCO800-16IO1 | IXYS | SCR THYRISTOR SGL 1600V WC-800 | Dotaz |
|
VVZB120-12IO2 | IXYS | 3-PHASE BRIDGE RECT 1600V 120A | Dotaz |
|
MCMA65P1600TA | IXYS | MOD THYRISTOR DUAL 16KV TO-240 | Dotaz |
|
IRKL91/10A | Vishay Semiconductor Diodes Division | SCR DBL HISCR 1000V 95A ADDAPAK | Dotaz |
|
VS-VSKL91/12 | Vishay Semiconductor Diodes Division | MODULE THYRISTOR 95A ADD-A-PAK | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers