Koupit MC44BS374T1EFR2 s BYCHPS
Koupit se zárukou
MC44BS374T1EFR2
- Part Number:
- MC44BS374T1EFR2
- Výrobce:
- NXP Semiconductors / Freescale
- Popis:
- IC AUDIO/VIDEO MODULATOR 16-SOIC
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19338 Pieces
- Datový list:
- MC44BS374T1EFR2.pdf
Úvod
BYCHIPS je distribuční odrůda pro MC44BS374T1EFR2, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MC44BS374T1EFR2 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | NTSC/PAL Modulator |
|---|---|
| Dodavatel zařízení Package: | 16-SOIC |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 16-SOIC (0.154", 3.90mm Width) |
| Ostatní jména: | MC44BS374T1EFR2TR |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | MC44BS374T1EFR2 |
| Rozšířený popis: | NTSC/PAL Modulator IC Audio/Video, VCR's, Set-Top Boxes 16-SOIC |
| Popis: | IC AUDIO/VIDEO MODULATOR 16-SOIC |
| Aplikace: | Audio/Video, VCR's, Set-Top Boxes |
| Email: | [email protected] |
Související díly pro MC44BS374T1EFR2
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MC44BS373CAD | NXP USA Inc. | AUDIO VIDEO INTERGRATION MOD | Dotaz |
|
MC44BS374T1EF | NXP USA Inc. | IC AUDIO/VIDEO MODULATOR 16-SOIC | Dotaz |
|
MC44BS374T1AEFR2 | NXP USA Inc. | IC AUDIO/VIDEO MODULATOR 16-SOIC | Dotaz |
|
MC44BS373CAFC | NXP USA Inc. | IC MODULATOR AUD/VID U/V 20-QFN | Dotaz |
|
MC44BS373CAEFR2 | NXP USA Inc. | IC AUD/VID PAL MODULATOR 16-SOIC | Dotaz |
|
MC44BS374CAEF | NXP USA Inc. | IC AUDIO/VIDEO MODULATOR 16-SOIC | Dotaz |
|
MC44BS374CAEFR2 | NXP USA Inc. | IC AUDIO/VIDEO MODULATOR 16-SOIC | Dotaz |
|
MC44BS374T1AEF | NXP USA Inc. | IC AUDIO/VIDEO MODULATOR 16-SOIC | Dotaz |
|
MC44BS373CAEF | NXP USA Inc. | AUDIO VIDEO INTERGRATION MOD | Dotaz |
|
MC44BS373CAFCR2 | NXP USA Inc. | IC MODULATOR AUD/VID U/V 20-QFN | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog