Koupit MAL804324031E3 s BYCHPS
Koupit se zárukou
MAL804324031E3
- Part Number:
- MAL804324031E3
- Výrobce:
- Angstrohm / Vishay
- Popis:
- MNT BRACKETP FOR ROUND CAN TYPES
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17215 Pieces
- Datový list:
- MAL804324031E3.pdf
Úvod
BYCHIPS je distribuční odrůda pro MAL804324031E3, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MAL804324031E3 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Specifikace: | Screw Clamp Type Bracket |
|---|---|
| Série: | - |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | MAL804324031E3 |
| Pro použití s / příbuzné výrobky: | Round Can Types |
| Velikost zařízení: | 1.378" Dia (35.0mm) |
| Popis: | MNT BRACKETP FOR ROUND CAN TYPES |
| Typ příslušenství: | Mounting Bracket |
| Email: | [email protected] |
Související díly pro MAL804324031E3
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MAL804324051E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Dotaz |
|
MAL804324021E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Dotaz |
|
MAL804324921E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Dotaz |
|
MAL804324061E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Dotaz |
|
MAL804324041E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Dotaz |
|
MAL804324011E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Dotaz |
|
MAL804320391E3 | Vishay BC Components | INSULAT DISK FOR STUD MNT TYPES | Dotaz |
|
MAL804323321E3 | Vishay BC Components | MNT BRACKET FOR ROUND CAN TYPES | Dotaz |
|
MAL804320381E3 | Vishay BC Components | INSULAT DISK FOR STUD MNT TYPES | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog