Koupit M58BW32FB4D150 s BYCHPS
Koupit se zárukou
M58BW32FB4D150
- Part Number:
- M58BW32FB4D150
- Výrobce:
- Micron Technology
- Popis:
- SLC 32M DIE 4MX8
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18373 Pieces
- Datový list:
- M58BW32FB4D150.pdf
Úvod
BYCHIPS je distribuční odrůda pro M58BW32FB4D150, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu M58BW32FB4D150 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Rychlost: | 45ns |
| Série: | - |
| Provozní teplota: | - |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Typ paměti: | Non-Volatile |
| Velikost paměti: | 32Mb (4M x 8) |
| Formát paměti: | FLASH |
| Výrobní číslo výrobce: | M58BW32FB4D150 |
| Rozhraní: | Parallel |
| Popis: | SLC 32M DIE 4MX8 |
| Email: | [email protected] |
Související díly pro M58BW32FB4D150
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
M58BW32FB5ZA3T TR | Micron Technology Inc. | IC FLASH 32MBIT 55NS LBGA | Dotaz |
|
M58BW32FT4D150 | Micron Technology Inc. | SLC 32M DIE 4MX8 | Dotaz |
 |
M58BW16FB5ZA3F TR | Micron Technology Inc. | IC FLASH 16BIT 80LBGA | Dotaz |
|
M58BW32FB5T3T TR | Micron Technology Inc. | IC FLASH 32MBIT 55NS 80QFP | Dotaz |
|
M58BW32FB4T3T TR | Micron Technology Inc. | IC FLASH 32MBIT 45NS 80QFP | Dotaz |
|
M58BW16FB5T3T TR | Micron Technology Inc. | IC FLASH 16MBIT 55NS 80QFP | Dotaz |
|
M58BW32FB5T3F TR | Micron Technology Inc. | IC FLASH 32MBIT 55NS 80QFP | Dotaz |
|
M58BW016FB7D150T TR | Micron Technology Inc. | IC FLASH 16MBIT 70NS DIE | Dotaz |
|
M58BW016FB7T3T TR | Micron Technology Inc. | IC FLASH 16MBIT 70NS 80QFP | Dotaz |
|
M58BW16FB5ZA3F | Micron Technology Inc. | IC FLASH 16BIT 80LBGA | Dotaz |
|
M58BW16FB4ZA3F TR | Micron Technology Inc. | IC FLASH 16MBIT 45NS 80LBGA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers