Koupit LSP05G277P s BYCHPS
Koupit se zárukou
LSP05G277P
- Part Number:
- LSP05G277P
- Výrobce:
- Littelfuse
- Popis:
- LSP THERMALLY PROTECTED VARISTOR
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12201 Pieces
Úvod
BYCHIPS je distribuční odrůda pro LSP05G277P, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu LSP05G277P e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Upínací: | - |
|---|---|
| Napětí: | 277V |
| Technika: | Surge Protector |
| Série: | LSP |
| Obal: | Bulk |
| Paket / krabice: | Module, Wire Leads |
| Ostatní jména: | F9372 |
| Počet okruhů: | 1 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 9 Weeks |
| Výrobní číslo výrobce: | LSP05G277P |
| Popis: | LSP THERMALLY PROTECTED VARISTOR |
| Aplikace: | LED Drivers, AC/DC SMPS |
| Email: | [email protected] |
Související díly pro LSP05G277P
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
LSP05G277SX3333 | Littelfuse Inc. | SURGE PROTECTOR 5KA 277VAC | Dotaz |
 |
LSP05G277S | Littelfuse Inc. | LSP THERMALLY PROTECTED VARISTOR | Dotaz |
 |
LSP05G240PX3333 | Littelfuse Inc. | SURGE PROTECTOR 5KA 240VAC | Dotaz |
|
LSP05G277PX3316 | Littelfuse Inc. | LSP THERMALLY PROTECTED VARISTOR | Dotaz |
|
LSP05G240SX3333 | Littelfuse Inc. | SURGE PROTECTOR 5KA 240VAC | Dotaz |
|
LSP05G277PX3333 | Littelfuse Inc. | SURGE PROTECTOR 5KA 277VAC | Dotaz |
|
LSP05G240S | Littelfuse Inc. | LSP THERMALLY PROTECTED VARISTOR | Dotaz |
|
LSP05G240SX3316 | Littelfuse Inc. | SURGE PROTECTOR 5KA 240VAC | Dotaz |
|
LSP05G277SX3316 | Littelfuse Inc. | SURGE PROTECTOR 5KA 277VAC | Dotaz |
|
LSP05G240PX3316 | Littelfuse Inc. | LSP THERMALLY PROTECTED VARISTOR | Dotaz |
|
LSP05G240P | Littelfuse Inc. | LSP THERMALLY PROTECTED VARISTOR | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers