Koupit LFB250150-000 s BYCHPS
Koupit se zárukou
LFB250150-000
- Part Number:
- LFB250150-000
- Popis:
- FERRITE CORE 26 OHM SOLID 15MM
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12243 Pieces
- Datový list:
- 1.LFB250150-000.pdf2.LFB250150-000.pdf
Úvod
BYCHIPS je distribuční odrůda pro LFB250150-000, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu LFB250150-000 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Round |
|---|---|
| Série: | LF |
| hodnocení: | - |
| Vnější rozměr: | 0.984" Dia (25.00mm) |
| Ostatní jména: | 240-2285 LFB250150000 |
| Typ montáže: | Free Hanging |
| Materiál: | LF |
| Výrobní standardní doba výroby: | 13 Weeks |
| Výrobní číslo výrobce: | LFB250150-000 |
| Délka: | 0.512" (13.00mm) |
| Vnitřní rozměr: | 0.591" Dia (15.00mm) |
| Impedance @ Frekvence: | 26 Ohm @ 5MHz |
| Rozšířený popis: | Solid Free Hanging Ferrite Core 26 Ohm @ 5MHz ID 0.591" Dia (15.00mm) OD 0.984" Dia (25.00mm) Length 0.512" (13.00mm) |
| Design: | Solid |
| Popis: | FERRITE CORE 26 OHM SOLID 15MM |
| Email: | [email protected] |
Související díly pro LFB250150-000
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
28B0250-100 | Laird-Signal Integrity Products | FERRITE CORE 182 OHM SOLID | Dotaz |
 |
ESD-SR-160 | KEMET | FERRITE CORE HINGED 9MM | Dotaz |
 |
ZCAT2017-0930-BK | TDK Corporation | FERRITE CORE 50 OHM HINGED 9MM | Dotaz |
 |
742701110 | Wurth Electronics Inc. | FERRITE CORE 153 OHM SOLID 18MM | Dotaz |
 |
ESD-R-25 | KEMET | FERRITE CORE SOLID 14MM | Dotaz |
 |
ESD-FPL-15 | KEMET | FERRITE CORE SOLID 23.5 X 1.5MM | Dotaz |
 |
LFB259128-000 | Laird-Signal Integrity Products | FERRITE CORE 62 OHM SOLID | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers