Koupit L612F s BYCHPS
Koupit se zárukou
L612F
- Part Number:
- L612F
- Výrobce:
- Crydom
- Popis:
- MODULE SCR/DIO 42.5A 240VAC PCB
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16796 Pieces
- Datový list:
- 1.L612F.pdf2.L612F.pdf
Úvod
BYCHIPS je distribuční odrůda pro L612F, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu L612F e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Off State: | 600V |
|---|---|
| Napětí - Gate Trigger (Vgt) (Max): | 3V |
| Struktura: | Bridge, Single Phase - SCRs/Diodes (Layout 1) |
| Série: | - |
| Obal: | Bulk |
| Paket / krabice: | Module |
| Ostatní jména: | L612F-ND |
| Provozní teplota: | -40°C ~ 125°C (TJ) |
| Počet SCR, diody: | 2 SCRs, 2 Diodes |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | L612F |
| Rozšířený popis: | SCR Module 600V 42.5A (DC) Bridge, Single Phase - SCRs/Diodes (Layout 1) Through Hole Module |
| Popis: | MODULE SCR/DIO 42.5A 240VAC PCB |
| Proud - Na státu (It (RMS)) (Max): | 42.5A (DC) |
| Proud -. Non Rep Surge 50, 60 Hz (ITSM): | 600A @ 60Hz |
| Proud - Gate Trigger (Igt) (Max): | 100mA |
| Email: | [email protected] |
Související díly pro L612F
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
VS-VSKV105/14 | Vishay Semiconductor Diodes Division | MODULE THYRISTOR 105A ADD-A-PAK | Dotaz |
 |
CD430890B | Powerex Inc. | SCR MOD ISO DUAL 800V 90A | Dotaz |
|
T720044504DN | Powerex Inc. | SCR PHSE CTRL 400V 450A TO200AC | Dotaz |
|
VS-VSKN26/08 | Vishay Semiconductor Diodes Division | MODULE THYRISTOR 27A ADD-A-PAK | Dotaz |
|
IRKH142/14 | Vishay Semiconductor Diodes Division | SCR DBL LOSCR 1400V 140A INTAPAK | Dotaz |
 |
F18107SD1400 | Crydom Co. | MODULE SCR/DIODE 105A 530VAC | Dotaz |
|
VS-VSKT230-04PBF | Vishay Semiconductor Diodes Division | MODULE DIODE SCR 230A MAGN-A-PAK | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers