Koupit KCC500E335M55N0T00 s BYCHPS
Koupit se zárukou
KCC500E335M55N0T00
- Part Number:
- KCC500E335M55N0T00
- Výrobce:
- Nippon Chemi-Con
- Popis:
- CAP CER 3.3UF 50V Y5V
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19173 Pieces
- Datový list:
- KCC500E335M55N0T00.pdf
Úvod
BYCHIPS je distribuční odrůda pro KCC500E335M55N0T00, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu KCC500E335M55N0T00 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 50V |
|---|---|
| Tolerance: | ±20% |
| Tloušťka (Max): | - |
| teplotní koeficient: | Y5V (F) |
| Velikost / Rozměry: | - |
| Série: | TCC |
| hodnocení: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | - |
| Provozní teplota: | - |
| Typ montáže: | - |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | KCC500E335M55N0T00 |
| Lead Style: | - |
| Rozestup vývodù: | - |
| Výška - Sedící (Max): | - |
| Funkce: | - |
| Rozšířený popis: | 3.3µF ±20% 50V Ceramic Capacitor Y5V (F) |
| Popis: | CAP CER 3.3UF 50V Y5V |
| kapacitní: | 3.3µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro KCC500E335M55N0T00
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
KCC500E105M43N0B00 | United Chemi-Con | CAP CER 1UF 50V Y5V | Dotaz |
|
KCC500E335Z55R0T00 | United Chemi-Con | CAP CER 3.3UF 50V Y5V | Dotaz |
|
KCC500E685M76N0T00 | United Chemi-Con | CAP CER 6.8UF 50V Y5U | Dotaz |
|
KCC500E105M43N0T00 | United Chemi-Con | CAP CER 1UF 50V Y5V | Dotaz |
|
KCC500E225M55N0T00 | United Chemi-Con | CAP CER 2.2UF 50V Y5V | Dotaz |
|
KCC500E225M55R0T00 | United Chemi-Con | CAP CER 2.2UF 50V Y5V | Dotaz |
|
KCC500E335M55R0T00 | United Chemi-Con | CAP CER 3.3UF 50V Y5V | Dotaz |
|
KCC500E685M76R0T00 | United Chemi-Con | CAP CER 6.8UF 50V Y5U | Dotaz |
|
KCC500E105M43R0T00 | United Chemi-Con | CAP CER 1UF 50V Y5V | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog