Koupit J174_D27Z s BYCHPS
Koupit se zárukou
J174_D27Z
- Part Number:
- J174_D27Z
- Výrobce:
- Fairchild/ON Semiconductor
- Popis:
- JFET P-CH 30V 0.35W TO92
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18609 Pieces
- Datový list:
- J174_D27Z.pdf
Úvod
BYCHIPS je distribuční odrůda pro J174_D27Z, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu J174_D27Z e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Cutoff (VGS off) 'Id: | 5V @ 10nA |
|---|---|
| Napětí - Breakdown (V (BR) GSS): | 30V |
| Dodavatel zařízení Package: | TO-92-3 |
| Série: | - |
| Odolnost - RDS (On): | 85 Ohm |
| Power - Max: | 350mW |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
| Provozní teplota: | -55°C ~ 150°C (TJ) |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | J174_D27Z |
| Vstupní kapacita (Ciss) (Max) @ Vds: | - |
| Typ FET: | P-Channel |
| Rozšířený popis: | JFET P-Channel 20mA @ 15V 350mW Through Hole TO-92-3 |
| Drain na zdroj napětí (Vdss): | - |
| Popis: | JFET P-CH 30V 0.35W TO92 |
| Proud - Drain (IDS) @ VDS (Vgs = 0): | 20mA @ 15V |
| Email: | [email protected] |
Související díly pro J174_D27Z
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
J174_D75Z | Fairchild/ON Semiconductor | JFET P-CH 30V 0.35W TO92 | Dotaz |
|
J174 | Fairchild/ON Semiconductor | JFET P-CH 30V 0.35W TO92 | Dotaz |
|
MMBF4091 | Fairchild/ON Semiconductor | JFET N-CH 40V 350MW SOT23 | Dotaz |
|
J174_D74Z | Fairchild/ON Semiconductor | JFET P-CH 30V 0.35W TO92 | Dotaz |
 |
2N5459_D74Z | Fairchild/ON Semiconductor | JFET N-CH 25V 625MW TO92 | Dotaz |
|
J105 | Fairchild/ON Semiconductor | JFET N-CH 25V 625MW TO92 | Dotaz |
|
PN4091_D26Z | Fairchild/ON Semiconductor | JFET N-CH 40V 0.625W TO92 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers