Koupit IS41C16105C-50TLI-TR s BYCHPS
Koupit se zárukou
IS41C16105C-50TLI-TR
- Part Number:
- IS41C16105C-50TLI-TR
- Popis:
- IC DRAM 16MBIT 50NS 54TSOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12369 Pieces
- Datový list:
- IS41C16105C-50TLI-TR.pdf
Úvod
BYCHIPS je distribuční odrůda pro IS41C16105C-50TLI-TR, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu IS41C16105C-50TLI-TR e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 4.5 V ~ 5.5 V |
|---|---|
| Dodavatel zařízení Package: | 54-TSOP II |
| Rychlost: | 50ns |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 54-TSOP (0.400", 10.16mm Width) |
| Provozní teplota: | -40°C ~ 85°C (TA) |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Typ paměti: | Volatile |
| Velikost paměti: | 16Mb (1M x 16) |
| Formát paměti: | DRAM |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | IS41C16105C-50TLI-TR |
| Rozhraní: | Parallel |
| Popis: | IC DRAM 16MBIT 50NS 54TSOP |
| Email: | [email protected] |
Související díly pro IS41C16105C-50TLI-TR
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
IS41C16105C-50KLI-TR | ISSI, Integrated Silicon Solution Inc | IC DRAM 16MBIT 50NS 42SOJ | Dotaz |
 |
IS41C16105C-50TLI | ISSI, Integrated Silicon Solution Inc | IC DRAM 16MBIT 50NS 54TSOP | Dotaz |
|
IS41C16100C-50TLI-TR | ISSI, Integrated Silicon Solution Inc | IC DRAM 16MBIT 50NS 54TSOP | Dotaz |
|
IS41C16105C-50KLI | ISSI, Integrated Silicon Solution Inc | IC DRAM 16MBIT 50NS 42SOJ | Dotaz |
|
IS41C16100C-50KLI | ISSI, Integrated Silicon Solution Inc | IC DRAM 16MBIT 50NS 42SOJ | Dotaz |
|
IS41C16100C-50KLI-TR | ISSI, Integrated Silicon Solution Inc | IC DRAM 16MBIT 50NS 42SOJ | Dotaz |
|
IS41C16100C-50TLI | ISSI, Integrated Silicon Solution Inc | IC DRAM 16MBIT 50NS 54TSOP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers