Koupit ILAS1206ER301V s BYCHPS
Koupit se zárukou
ILAS1206ER301V
- Part Number:
- ILAS1206ER301V
- Výrobce:
- Dale / Vishay
- Popis:
- FERRITE BEAD 300 OHM 1206 4LN
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15637 Pieces
- Datový list:
- ILAS1206ER301V.pdf
Úvod
BYCHIPS je distribuční odrůda pro ILAS1206ER301V, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu ILAS1206ER301V e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Velikost / Rozměry: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
|---|---|
| Série: | ILAS-1206 |
| hodnocení: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 1206 (3216 Metric), Array, 8 PC Pad |
| Provozní teplota: | -55°C ~ 125°C |
| Počet řádků: | 4 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | ILAS1206ER301V |
| Impedance @ Frekvence: | 300 Ohm @ 100MHz |
| Výška (Max): | 0.039" (1.00mm) |
| Typ filtru: | Signal Line |
| Popis: | FERRITE BEAD 300 OHM 1206 4LN |
| DC odpor (DCR) (Max): | 400 mOhm |
| Karta Tloušťka (mm): | 250mA |
| Email: | [email protected] |
Související díly pro ILAS1206ER301V
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
ILAS1206ER102V | Vishay Dale | FERRITE BEAD 1 KOHM 1206 4LN | Dotaz |
|
ILAS1206ER600V | Vishay Dale | FERRITE BEAD 60 OHM 1206 4LN | Dotaz |
 |
FL05RD100AZ | Taiyo Yuden | FERRITE BEAD 900 OHM RADIAL 1LN | Dotaz |
 |
MMZ1608A152ETA00 | TDK Corporation | FERRITE BEAD 1.5 KOHM 0603 1LN | Dotaz |
|
ILAS1206ER121V | Vishay Dale | FERRITE BEAD 120 OHM 1206 4LN | Dotaz |
|
ILAS1206ER601V | Vishay Dale | FERRITE BEAD 600 OHM 1206 4LN | Dotaz |
 |
MMZ2012Y301BTD25 | TDK Corporation | FERRITE BEAD 300 OHM 0805 1LN | Dotaz |
 |
MMZ0603Y601CT000 | TDK Corporation | FERRITE BEAD 600 OHM 0201 1LN | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers