Koupit IDT74SSTU32865BKG8 s BYCHPS
Koupit se zárukou
IDT74SSTU32865BKG8
- Part Number:
- IDT74SSTU32865BKG8
- Popis:
- IC BUFFER 28BIT 1:2 REG 160TFBGA
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18505 Pieces
- Datový list:
- 1.IDT74SSTU32865BKG8.pdf2.IDT74SSTU32865BKG8.pdf
Úvod
BYCHIPS je distribuční odrůda pro IDT74SSTU32865BKG8, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu IDT74SSTU32865BKG8 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napájení: | 1.7 V ~ 1.9 V |
|---|---|
| Dodavatel zařízení Package: | 160-CABGA (9x13) |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 160-LFBGA |
| Ostatní jména: | 74SSTU32865BKG8 |
| Provozní teplota: | 0°C ~ 70°C |
| Počet bitů: | 28 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | IDT74SSTU32865BKG8 |
| Typ logiky: | 1:2 Registered Buffer with Parity |
| Rozšířený popis: | 1:2 Registered Buffer with Parity IC 160-CABGA (9x13) |
| Popis: | IC BUFFER 28BIT 1:2 REG 160TFBGA |
| Email: | [email protected] |
Související díly pro IDT74SSTU32865BKG8
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
IDT74SSTU32864ABFG | IDT, Integrated Device Technology Inc | IC BUFFER 1:1/1:2 96-LFBGA | Dotaz |
|
IDT74SSTU32864DBFG8 | IDT, Integrated Device Technology Inc | IC BUFFER 1:1/1:2 96-LFBGA | Dotaz |
|
IDT74SSTU32864ABFG8 | IDT, Integrated Device Technology Inc | IC BUFFER 1:1/1:2 96-LFBGA | Dotaz |
|
IDT74SSTU32864DBFG | IDT, Integrated Device Technology Inc | IC BUFFER 1:1/1:2 96-LFBGA | Dotaz |
|
IDT74SSTU32D868BKG | IDT, Integrated Device Technology Inc | IC BUFFER 28BIT 1:2 REG 176TFBGA | Dotaz |
|
IDT74SSTU32D868BKG8 | IDT, Integrated Device Technology Inc | IC BUFFER 28BIT 1:2 REG 176TFBGA | Dotaz |
|
IDT74SSTU32865BKG | IDT, Integrated Device Technology Inc | IC BUFFER 28BIT 1:2 REG 160TFBGA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers